Organic light-emitting display device with frit seal and reinforcing structure bonded to frame

[0001] This application claims the benefit of Korean Patent Application No. 2006-7893, filed on Jan. 25, 2006, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. This application is related to and incorporates herein by reference the entire contents of the following concurrently filed applications:

			Application
Title	Atty. Docket No.	Filing Date	No.
ORGANIC LIGHT-EMITTING DISPLAY	SDISHN.043AUS
DEVICE AND METHOD OF
FABRICATING THE SAME
ORGANIC LIGHT-EMITTING DISPLAY	SDISHN.045AUS
DEVICE AND METHOD OF
MANUFACTURING THE SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISHN.048AUS
DEVICE
ORGANIC LIGHT-EMITTING DISPLAY	SDISHN.051AUS
DEVICE WITH FRIT SEAL AND
REINFORCING STRUCTURE
ORGANIC LIGHT EMITTING DISPLAY	SDISHN.052AUS
DEVICE METHOD OF FABRICATING
THE SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISHN.053AUS
AND METHOD OF FABRICATING THE
SAME
METHOD FOR PACKAGING ORGANIC	SDISHN.055AUS
LIGHT EMITTING DISPLAY WITH
FRIT SEAL AND REINFORCING
STURUTURE
METHOD FOR PACKAGING ORGANIC	SDISHN.056AUS
LIGHT EMITTING DISPLAY WITH
FRIT SEAL AND REINFORCING
STURUTURE
ORGANIC LIGHT-EMITTING DISPLAY	SDISHN.060AUS
DEVICE AND THE PREPARATION
METHOD OF THE SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISHN.061AUS
AND FABRICATING METHOD OF THE
SAME
ORGANIC LIGHT-EMITTING DISPLAY	SDISHN.062AUS
AND METHOD OF MAKING THE
SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISHN.063AUS
AND FABRICATING METHOD OF THE
SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISHN.064AUS
DEVICE AND MANUFACTURING
METHOD THEREOF
ORGANIC LIGHT-EMITTTNG DISPLAY	SDISHN.066AUS
DEVICE AND MANUFACTURING
METHOD OF THE SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISW.017AUS
AND METHOD OF FABRICATING THE
SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISW.018AUS
DEVICE METHOD OF FABRICATING
THE SAME
ORGANIC LIGHT EMITTING DISPLAY	SDISW.020AUS
AND METHOD OF FABRICATING THE
SAME

[0002] 1. Field of the Invention

[0003] The present invention relates to organic light-emitting display devices and, more particularly, to packaging such devices.

[0004] 2. Discussion of Related Art

[0005] An organic light-emitting display device is one of the flat panel displays in which an electron injected to one electrode and a hole injected to the other electrode binds to each other in an organic light-emitting layer when the organic light-emitting layer is arranged between facing electrodes and a voltage is applied to both electrodes, wherein when luminescent molecules of the light-emitting layer are excited by binding of the electron and the hole, energy is emitted by returning to a ground state, and then converted into the light. The organic light-emitting display devices exhibiting such a light-emission principle has drawn attention as a next-generation display since they are excellent in visibility, and they may be also manufactured in a light weight and thin shape and driven at a low voltage. U.S. Pat. No. 6,998,776 B2 discloses that an organic light-emitting display includes a first substrate plate, a second substrate plate and a frit connecting the plates.

[0006] An aspect of the invention provides an organic light-emitting display device, which may comprises: an organic light-emitting display unit comprising: a front substrate comprising a front surface and a first side surface, a rear substrate comprising a rear surface and a first side surface, the rear substrate opposing the front substrate, an array of organic light-emitting pixels interposed between the front and rear substrates, a frit seal interposed between the front substrate and the rear substrate while surrounding the array, wherein the frit seal, the front substrate and the rear substrate together define an enclosed space in which the array is located, the frit seal comprising a first side surface, and a first side comprising the first side surfaces of the front substrate, the rear substrate and the frit seal; a bracket comprising a first surface generally opposing the first side of the unit and connected to the first side of the unit; and a first structure interconnecting the first surface of the bracket and the first side of the unit.

[0007] In the foregoing device, the first structure may be formed in substantially the entire area between the first surface of the bracket and the first side of the unit. The first structure may be formed on substantially throughout the first surface of the bracket. The first structure may be bonded to the first surface of the bracket and bonded to either or both of the first side surfaces of the front and rear substrates. The first structure may be bonded to the first side surface of the frit seal. The front substrate, the rear substrate and the first side surface of the frit seal may define a gap space, and wherein the first structure may comprise a portion extending into the gap space and interposed between the front and rear substrates. The bracket may further comprise a rear wall opposing the rear substrate. The rear wall of the bracket may be bonded to the rear surface of the rear substrate. The bracket may comprise a rear wall opposing the rear substrate, and the bracket may further comprise a plurality of side walls extending from the rear wall at an angle, and wherein a first one of the plurality of the side walls may provide the first surface opposing the first side of the unit. The first side wall may extend substantially parallel to at least one of the first side surfaces of the front and rear substrates. The first side wall may cover substantially the entirety of the first side of the unit. The first side wall may not cover at least part of the first side surface of the front substrate while generally opposing the first side of the unit. The first side wall may not cover the first side surface of the front substrate while generally opposing the first side of the unit. The structure may comprise a layer comprising a polymeric material.

[0008] Still in the foregoing device, the unit may further comprise a plurality additional sides, wherein the bracket comprises a first side wall and a plurality of additional side walls, the first side wall providing the first surface of the frame, wherein each of the plurality of additional side walls of the bracket may comprise a surface generally opposing one of the plurality of additional sides of the unit, wherein the device may further comprise a plurality of additional structures, each of which interconnects one of the plurality of additional side walls and one of the plurality of additional sides of the unit. The first side wall and the plurality of additional side walls may form a closed loop surrounding the first side and the plurality of additional sides of the unit. The front substrate may further comprise a second side surface, wherein the rear substrate may further comprise a second side surface, wherein the frit seal may further comprise a second side surface, wherein the second side surfaces of the front substrate, the second substrate and the frit seal generally face the same direction, wherein the unit may further comprise a second side comprising a second side surface of the front substrate, a second side surface of the rear substrate and a second side surface of the frit seal, wherein the bracket may further comprise a second surface generally opposing the second side of the device, and wherein the unit may further comprise a second structure interconnecting the second side of the unit and the second surface of the frame. The first and second structures may be integrated. The first and second structures may be separated. The frit seal may comprise one or more materials selected from the group consisting of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li₂O), sodium oxide (Na₂O), potassium oxide (K₂O), boron oxide (B₂O₃), vanadium oxide (V₂O₅), zinc oxide (ZnO), tellurium oxide (TeO₂), aluminum oxide (Al₂O₃), silicon dioxide (SiO₂), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P₂O₅), ruthenium oxide (Ru₂O), rubidium oxide (Rb₂O), rhodium oxide (Rh₂O), ferrite oxide (Fe₂O₃), copper oxide (CuO), titanium oxide (TiO₂), tungsten oxide (WO₃), bismuth oxide (Bi₂O₃), antimony oxide (Sb₂O₃), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate.

[0009] Another aspect of the invention provides a method of making an organic light-emitting display device, which may comprises: providing a device comprising: a front substrate comprising a front surface and a first side surface, a rear substrate comprising a rear surface and a first side surface, the rear substrate opposing the front substrate, an array of organic light-emitting pixels interposed between the front and rear substrates, a frit seal interposed between the front substrate and the rear substrate while surrounding the array, wherein the frit seal, the front substrate and the rear substrate together define an enclosed space in which the array is located, the frit seal comprising a first side surface, and a first side comprising the first sides of the front substrate, the rear substrate and the frit seal; placing a bracket comprising a first surface so as to generally the first side of the device; and forming a structure between and interconnecting the first surface of the bracket and the first side of the device.

[0010] In the foregoing method, the method may further comprise forming a curable material on the first surface of the frame, and wherein placing the bracket may comprise arranging the bracket with respect to the device such that the curable material contacts the first side of the device. The method may further comprise curing the curable material, thereby forming the structure. A viscosity of the curable material may be less than about 5000 cP. The bracket may further comprise a rear wall, and wherein placing the bracket may further comprise arranging the rear wall so as to oppose the rear substrate.

[0011] Still another aspect of the present invention provides an organic light-emitting display device including a first substrate comprising a pixel region in which an organic light-emitting diode is formed in a surface thereof, and a non-pixel region formed in a circumference of the pixel region, the organic light-emitting diode comprising an organic light-emitting layer between a first electrode and a second electrode; a second substrate attached to one surface comprising the pixel region of the first substrate; a frit provided between the non-pixel region of the first substrate and the second substrate and attaching the first substrate and the second substrate to each other; a bracket with which the first substrate and the second substrate, both attached to each other, are mounted; and a reinforcement material applied to an inner wall of the bracket, infiltrated between the attached first and second substrates, and then cured.

[0012] Further aspect of the present invention provides a method for preparing an organic light-emitting display device including a first substrate including an organic light-emitting diode, and an encapsulation substrate for encapsulating at least a pixel region of the substrate, the method including the first step of applying a frit to form a line spaced apart from an edge of the encapsulation substrate; the second step of attaching a deposition substrate, on which an organic light-emitting diode is deposited, to the second substrate; the third step of melting the frit to attach the first substrate and the second substrate to each other by irradiating a laser or an infrared ray to the frit between the first substrate and the second substrate, both attached to each other; the fourth step of applying a reinforcement material for filling a gap between the first substrate and the second substrate in an inner wall of the bracket with which the attached first and second substrates are mounted; and the fifth step of mounting the first and second substrates so that the sealing material applied in the inner wall of the bracket can be in contact with the gap between the first substrate and the second substrate, both attached to each other. The organic light-emitting diode may be completely protected from the open air by completely coalescing a substrate and a encapsulation substrate to each other using a frit and solving brittleness of the organic light-emitting display device when the frit is used herein.

[0023] Hereinafter, embodiments according to the present invention will be described with reference to the accompanying drawings.

[0024] An organic light emitting display (OLED) is a display device comprising an array of organic light emitting diodes. Organic light emitting diodes are solid state devices which include an organic material and are adapted to generate and emit light when appropriate electrical potentials are applied.

[0025] OLEDs can be generally grouped into two basic types dependent on the arrangement with which the stimulating electrical current is provided. FIG. 6A schematically illustrates an exploded view of a simplified structure of a passive matrix type OLED 1000. FIG. 5B schematically illustrates a simplified structure of an active matrix type OLED 1001. In both configurations, the OLED 1000, 1001 includes OLED pixels built over a substrate 1002, and the OLED pixels include an anode 1004, a cathode 1006 and an organic layer 1010. When an appropriate electrical current is applied to the anode 1004, electric current flows through the pixels and visible light is emitted from the organic layer.

[0026] Referring to FIG. 5A, the passive matrix OLED (PMOLED) design includes elongate strips of anode 1004 arranged generally perpendicular to elongate strips of cathode 1006 with organic layers interposed therebetween. The intersections of the strips of cathode 1006 and anode 1004 define individual OLED pixels where light is generated and emitted upon appropriate excitation of the corresponding strips of anode 1004 and cathode 1006. PMOLEDs provide the advantage of relatively simple fabrication.

[0027] Referring to FIG. 5B, the active matrix OLED (AMOLED) includes localdriving circuits 1012 arranged between the substrate 1002 and an array of OLED pixels. An individual pixel of AMOLEDs is defined between the common cathode 1006 and an anode 1004, which is electrically isolated from other anodes. Each driving circuit 1012 is coupled with an anode 1004 of the OLED pixels and further coupled with a data line 1016 and a scan line 1018. In embodiments, the scan lines 1018 supply scan signals that select rows of the driving circuits, and the data lines 1016 supply data signals for particular driving circuits. The data signals and scan signals stimulate the local driving circuits 1012, which excite the anodes 1004 so as to emit light from their corresponding pixels.

[0028] In the illustrated AMOLED, the local driving circuits 1012, the data lines 1016 and scan lines 1018 are buried in a planarization layer 1014, which is interposed between the pixel array and the substrate 1002. The planarization layer 1014 provides a planar top surface on which the organic light emitting pixel array is formed. The planarization layer 1014 may be formed of organic or inorganic materials, and formed of two or more layers although shown as a single layer. The local driving circuits 1012 are typically formed with thin film transistors (TFT) and arranged in a grid or array under the OLED pixel array. The local driving circuits 1012 may be at least partly made of organic materials, including organic TFT. AMOLEDs have the advantage of fast response time improving their desirability for use in displaying data signals. Also, AMOLEDs have the advantages of consuming less power than passive matrix OLEDs.

[0029] Referring to common features of the PMOLED and AMOLED designs, the substrate 1002 provides structural support for the OLED pixels and circuits. In various embodiments, the substrate 1002 can comprise rigid or flexible materials as well as opaque or transparent materials, such as plastic, glass, and/or foil. As noted above, each OLED pixel or diode is formed with the anode 1004, cathode 1006 and organic layer 1010 interposed therebetween. When an appropriate electrical current is applied to the anode 1004, the cathode 1006 injects electrons and the anode 1004 injects holes. In certain embodiments, the anode 1004 and cathode 1006 are inverted; i.e., the cathode is formed on the substrate 1002 and the anode is opposingly arranged.

[0030] Interposed between the cathode 1006 and anode 1004 are one or more organic layers. More specifically, at least one emissive or light emitting layer is interposed between the cathode 1006 and anode 1004. The light emitting layer may comprise one or more light emitting organic compounds. Typically, the light emitting layer is configured to emit visible light in a single color such as blue, green, red or white. In the illustrated embodiment, one organic layer 1010 is formed between the cathode 1006 and anode 1004 and acts as a light emitting layer. Additional layers, which can be formed between the anode 1004 and cathode 1006, can include a hole transporting layer, a hole injection layer, an electron transporting layer and an electron injection layer.

[0031] Hole transporting and/or injection layers can be interposed between the light emitting layer 1010 and the anode 1004. Electron transporting and/or injecting layers can be interposed between the cathode 1006 and the light emitting layer 1010. The electron injection layer facilitates injection of electrons from the cathode 1006 toward the light emitting layer 1010 by reducing the work function for injecting electrons from the cathode 1006. Similarly, the hole injection layer facilitates injection of holes from the anode 1004 toward the light emitting layer 1010. The hole and electron transporting layers facilitate movement of the carriers injected from the respective electrodes toward the light emitting layer.

[0032] In some embodiments, a single layer may serve both electron injection and transportation functions or both hole injection and transportation functions. In some embodiments, one or more of these layers are lacking. In some embodiments, one or more organic layers are doped with one or more materials that help injection and/or transportation of the carriers. In embodiments where only one organic layer is formed between the cathode and anode, the organic layer may include not only an organic light emitting compound but also certain functional materials that help injection or transportation of carriers within that layer.

[0033] There are numerous organic materials that have been developed for use in these layers including the light emitting layer. Also, numerous other organic materials for use in these layers are being developed. In some embodiments, these organic materials may be macromolecules including oligomers and polymers. In some embodiments, the organic materials for these layers may be relatively small molecules. The skilled artisan will be able to select appropriate materials for each of these layers in view of the desired functions of the individual layers and the materials for the neighboring layers in particular designs.

[0034] In operation, an electrical circuit provides appropriate potential between the cathode 1006 and anode 1004. This results in an electrical current flowing from the anode 1004 to the cathode 1006 via the interposed organic layer(s). In one embodiment, the cathode 1006 provides electrons to the adjacent organic layer 1010. The anode 1004 injects holes to the organic layer 1010. The holes and electrons recombine in the organic layer 1010 and generate energy particles called “excitons.” The excitons transfer their energy to the organic light emitting material in the organic layer 1010, and the energy is used to emit visible light from the organic light emitting material. The spectral characteristics of light generated and emitted by the OLED 1000, 1001 depend on the nature and composition of organic molecules in the organic layer(s). The composition of the one or more organic layers can be selected to suit the needs of a particular application by one of ordinary skill in the art.

[0035] OLED devices can also be categorized based on the direction of the light emission. In one type referred to as “top emission” type, OLED devices emit light and display images through the cathode or top electrode 1006. In these embodiments, the cathode 1006 is made of a material transparent or at least partially transparent with respect to visible light. In certain embodiments, to avoid losing any light that can pass through the anode or bottom electrode 1004, the anode may be made of a material substantially reflective of the visible light. A second type of OLED devices emits light through the anode or bottom electrode 1004 and is called “bottom emission” type. In the bottom emission type OLED devices, the anode 1004 is made of a material which is at least partially transparent with respect to visible light. Often, in bottom emission type OLED devices, the cathode 1006 is made of a material substantially reflective of the visible light. A third type of OLED devices emits light in two directions, e.g. through both anode 1004 and cathode 1006. Depending upon the direction(s) of the light emission, the substrate may be formed of a material which is transparent, opaque or reflective of visible light.

[0036] In many embodiments, an OLED pixel array 1021 comprising a plurality of organic light emitting pixels is arranged over a substrate 1002 as shown in FIG. 5C. In embodiments, the pixels in the array 1021 are controlled to be turned on and off by a driving circuit (not shown), and the plurality of the pixels as a whole displays information or image on the array 1021. In certain embodiments, the OLED pixel array 1021 is arranged with respect to other components, such as drive and control electronics to define a display region and a non-display region. In these embodiments, the display region refers to the area of the substrate 1002 where OLED pixel array 1021 is formed. The non-display region refers to the remaining areas of the substrate 1002. In embodiments, the non-display region can contain logic and/or power supply circuitry. It will be understood that there will be at least portions of control/drive circuit elements arranged within the display region. For example, in PMOLEDs, conductive components will extend into the display region to provide appropriate potential to the anode and cathodes. In AMOLEDs, local driving circuits and data/scan lines coupled with the driving circuits will extend into the display region to drive and control the individual pixels of the AMOLEDs.

[0037] One design and fabrication consideration in OLED devices is that certain organic material layers of OLED devices can suffer damage or accelerated deterioration from exposure to water, oxygen or other harmful gases. Accordingly, it is generally understood that OLED devices be sealed or encapsulated to inhibit exposure to moisture and oxygen or other harmful gases found in a manufacturing or operational environment. FIG. 5D schematically illustrates a cross-section of an encapsulated OLED device 1011 having a layout of FIG. 5C and taken along the line d-d of FIG. 5C. In this embodiment, a generally planar top plate or substrate 1061 engages with a seal 1071 which further engages with a bottom plate or substrate 1002 to enclose or encapsulate the OLED pixel array 1021. In other embodiments, one or more layers are formed on the top plate 1061 or bottom plate 1002, and the seal 1071 is coupled with the bottom or top substrate 1002, 1061 via such a layer. In the illustrated embodiment, the seal 1071 extends along the periphery of the OLED pixel array 1021 or the bottom or top plate 1002, 1061.

[0038] In embodiments, the seal 1071 is made of a frit material as will be further discussed below. In various embodiments, the top and bottom plates 1061, 1002 comprise materials such as plastics, glass and/or metal foils which can provide a barrier to passage of oxygen and/or water to thereby protect the OLED pixel array 1021 from exposure to these substances. In embodiments, at least one of the top plate 1061 and the bottom plate 1002 are formed of a substantially transparent material.

[0039] To lengthen the life time of OLED devices 1011, it is generally desired that seal 1071 and the top and bottom plates 1061, 1002 provide a substantially non-permeable seal to oxygen and water vapor and provide a substantially hermetically enclosed space 1081. In certain applications, it is indicated that the seal 1071 of a frit material in combination with the top and bottom plates 1061, 1002 provide a barrier to oxygen of less than approximately 10⁻³ cc/m²-day and to water of less than 10⁻⁶ g/m²-day. Given that some oxygen and moisture can permeate into the enclosed space 1081, in some embodiments, a material that can take up oxygen and/or moisture is formed within the enclosed space 1081.

[0040] The seal 1071 has a width W, which is its thickness in a direction parallel to a surface of the top or bottom substrate 1061, 1002 as shown in FIG. 5D. The width varies among embodiments and ranges from about 300 μm to about 3000 μm, optionally from about 500 μm to about 1500 μm. Also, the width may vary at different positions of the seal 1071. In some embodiments, the width of the seal 1071 may be the largest where the seal 1071 contacts one of the bottom and top substrate 1002, 1061 or a layer formed thereon. The width may be the smallest where the seal 1071 contacts the other. The width variation in a single cross-section of the seal 1071 relates to the cross-sectional shape of the seal 1071 and other design parameters.

[0041] The seal 1071 has a height H, which is its thickness in a direction perpendicular to a surface of the top or bottom substrate 1061, 1002 as shown in FIG. 5D. The height varies among embodiments and ranges from about 2 μm to about 30 μm, optionally from about 10 μm to about 15 μm. Generally, the height does not significantly vary at different positions of the seal 1071. However, in certain embodiments, the height of the seal 1071 may vary at different positions thereof.

[0042] In the illustrated embodiment, the seal 1071 has a generally rectangular cross-section. In other embodiments, however, the seal 1071 can have other various cross-sectional shapes such as a generally square cross-section, a generally trapezoidal cross-section, a cross-section with one or more rounded edges, or other configuration as indicated by the needs of a given application. To improve hermeticity, it is generally desired to increase the interfacial area where the seal 1071 directly contacts the bottom or top substrate 1002, 1061 or a layer formed thereon. In some embodiments, the shape of the seal can be designed such that the interfacial area can be increased.

[0043] The seal 1071 can be arranged immediately adjacent the OLED array 1021, and in other embodiments, the seal 1071 is spaced some distance from the OLED array 1021. In certain embodiment, the seal 1071 comprises generally linear segments that are connected together to surround the OLED array 1021. Such linear segments of the seal 1071 can extend, in certain embodiments, generally parallel to respective boundaries of the OLED array 1021. In other embodiment, one or more of the linear segments of the seal 1071 are arranged in a non-parallel relationship with respective boundaries of the OLED array 1021. In yet other embodiments, at least part of the seal 1071 extends between the top plate 1061 and bottom plate 1002 in a curvilinear manner.

[0044] As noted above, in certain embodiments, the seal 1071 is formed using a frit material or simply “frit” or glass frit,” which includes fine glass particles. The frit particles includes one or more of magnesium oxide (MgO), calcium oxide (CaO), barium oxide (BaO), lithium oxide (Li₂O), sodium oxide (Na₂O), potassium oxide (K₂O), boron oxide (B₂O₃), vanadium oxide (V₂O₅), zinc oxide (ZnO), tellurium oxide (TeO₂), aluminum oxide (Al₂O₃), silicon dioxide (SiO₂), lead oxide (PbO), tin oxide (SnO), phosphorous oxide (P₂O₅), ruthenium oxide (Ru₂O), rubidium oxide (Rb₂O), rhodium oxide (Rh₂O), ferrite oxide (Fe₂O₃), copper oxide (CuO), titanium oxide (TiO₂), tungsten oxide (WO₃), bismuth oxide (Bi₂O₃), antimony oxide (Sb₂O₃), lead-borate glass, tin-phosphate glass, vanadate glass, and borosilicate, etc. In embodiments, these particles range in size from about 2 μm to about 30 μm, optionally about 5 μm to about 10 μm, although not limited only thereto. The particles can be as large as about the distance between the top and bottom substrates 1061, 1002 or any layers formed on these substrates where the frit seal 1071 contacts.

[0045] The frit material used to form the seal 1071 can also include one or more filler or additive materials. The filler or additive materials can be provided to adjust an overall thermal expansion characteristic of the seal 1071 and/or to adjust the absorption characteristics of the seal 1071 for selected frequencies of incident radiant energy. The filler or additive material(s) can also include inversion and/or additive fillers to adjust a coefficient of thermal expansion of the frit. For example, the filler or additive materials can include transition metals, such as chromium (Cr), iron (Fe), manganese (Mn), cobalt (Co), copper (Cu), and/or vanadium. Additional materials for the filler or additives include ZnSiO₄, PbTiO₃, ZrO₂, eucryptite.

[0046] In embodiments, a frit material as a dry composition contains glass particles from about 20 to 90 about wt %, and the remaining includes fillers and/or additives. In some embodiments, the frit paste contains about 10-30 wt % organic materials and about 70-90% inorganic materials. In some embodiments, the frit paste contains about 20 wt % organic materials and about 80 wt % inorganic materials. In some embodiments, the organic materials may include about 0-30 wt % binder(s) and about 70-100 wt % solvent(s). In some embodiments, about 10 wt % is binder(s) and about 90 wt % is solvent(s) among the organic materials. In some embodiments, the inorganic materials may include about 0-10 wt % additives, about 20-40 wt % fillers and about 50-80 wt % glass powder. In some embodiments, about 0-5 wt % is additive(s), about 25-30 wt % is filler(s) and about 65-75 wt % is the glass powder among the inorganic materials.

[0047] In forming a frit seal, a liquid material is added to the dry frit material to form a frit paste. Any organic or inorganic solvent with or without additives can be used as the liquid material. In embodiments, the solvent includes one or more organic compounds. For example, applicable organic compounds are ethyl cellulose, nitro cellulose, hydroxyl propyl cellulose, butyl carbitol acetate, terpineol, butyl cellusolve, acrylate compounds. Then, the thus formed frit paste can be applied to form a shape of the seal 1071 on the top and/or bottom plate 1061, 1002.

[0048] In one exemplary embodiment, a shape of the seal 1071 is initially formed from the frit paste and interposed between the top plate 1061 and the bottom plate 1002. The seal 1071 can in certain embodiments be pre-cured or pre-sintered to one of the top plate and bottom plate 1061, 1002. Following assembly of the top plate 1061 and the bottom plate 1002 with the seal 1071 interposed therebetween, portions of the seal 1071 are selectively heated such that the frit material forming the seal 1071 at least partially melts. The seal 1071 is then allowed to resolidify to form a secure joint between the top plate 1061 and the bottom plate 1002 to thereby inhibit exposure of the enclosed OLED pixel array 1021 to oxygen or water.

[0049] In embodiments, the selective heating of the frit seal is carried out by irradiation of light, such as a laser or directed infrared lamp. As previously noted, the frit material forming the seal 1071 can be combined with one or more additives or filler such as species selected for improved absorption of the irradiated light to facilitate heating and melting of the frit material to form the seal 1071.

[0050] In some embodiments, OLED devices 1011 are mass produced. In an embodiment illustrated in FIG. 5E, a plurality of separate OLED arrays 1021 is formed on a common bottom substrate 1101. In the illustrated embodiment, each OLED array 1021 is surrounded by a shaped frit to form the seal 1071. In embodiments, common top substrate (not shown) is placed over the common bottom substrate 1101 and the structures formed thereon such that the OLED arrays 1021 and the shaped frit paste are interposed between the common bottom substrate 1101 and the common top substrate. The OLED arrays 1021 are encapsulated and sealed, such as via the previously described enclosure process for a single OLED display device. The resulting product includes a plurality of OLED devices kept together by the common bottom and top substrates. Then, the resulting product is cut into a plurality of pieces, each of which constitutes an OLED device 1011 of FIG. 5D. In certain embodiments, the individual OLED devices 1011 then further undergo additional packaging operations to further improve the sealing formed by the frit seal 1071 and the top and bottom substrates 1061, 1002.

[0051] One problem of the organic light-emitting display device is that the device can be deteriorated when moisture contacts organic materials constituting the organic light-emitting elements. FIG. 1 is a cross-sectional view showing an encapsulation structure of an organic light-emitting device that can prevent moisture from contacting organic materials. In the illustrated structure, the organic light-emitting display device is including a substrate 1, an encapsulation substrate 2, a sealing material 3, a moisture-absorbing material 4 and a bracket 5. The substrate 1 includes a pixel region including at least one organic light-emitting device, and a non-pixel region formed outside the pixel region, and the encapsulation substrate 2 is attached against a surface in which organic light-emitting elements of the substrate 1 are formed.

[0052] In order to attach the substrate 1 to the encapsulation substrate 2, the sealing material 3 is applied along edges of the deposition substrate 1 and the encapsulation substrate 2, and the sealing material 3 is then cured using UV irradiation, etc. A moisture-absorbing material 4 is included in the encapsulation substrate 2 for capturing moisture and certain gases such as hydrogen, oxygen. The bracket 5 is a kind of a frame for supporting an organic light-emitting panel to which the substrate 1 and the encapsulation substrate 2 are attached. In one embodiment, the bracket 5 and the organic light-emitting device may be attached with a double side adhesive tape. Even in the illustrated device, however, the sealing material 3 may not completely prevent moisture or air entering into the enclosed space. Also, there may be cracks in the sealing material 3 and in the interfacial area where the sealing material 3 contacts the substrate for various reasons.

[0053] FIG. 2 is a plan view showing an organic light-emitting display device according to one embodiment of the present invention; and FIG. 3 is a plane view taken along a line A-A′ of FIG. 2. Referring to figures, the organic light-emitting display device includes a substrate 100, an encapsulation substrate 200, a frit 150 and a reinforcement material or structure 160. For the sake of convenience, the deposition substrate 101 refers to a base, on which circuits and layers are formed, and the substrate 100 refers to an unfinished product including the deposition substrate 101 and circuits and layers formed thereon, including an array of organic light emitting pixels.

[0054] The substrate 100, which is equivalent to the bottom plate 1002, is a plate including organic light-emitting diodes or pixels, and includes a pixel region 100a in which at least one organic light-emitting diode or pixel is formed, and a non-pixel region 100b formed outside of the pixel region 100a, the organic light-emitting diode including a first electrode 119, an organic layer 121 and a second electrode 122. Hereinafter, the pixel region 100a is referred to as a region for displaying a predetermined image using the light emitted from an organic light-emitting diode, and the non-pixel region 100b is referred to as the entire region except the pixel region 100a on the substrate 100 in the description of this application.

[0055] The pixel region 100a includes a plurality of scan lines (S1 to Sm) arranged in a horizontal direction, and a plurality of data lines (D1 to Dm) arranged in a vertical direction, and a plurality of pixels are formed in the scan lines (S1 to Sm) and the data lines (D1 to Dm), the pixels receiving signals from driver integrated circuits 300,400 for driving an organic light-emitting diode. Also, a driver integrated circuit (Driver IC) for driving an organic light-emitting diodes or pixels, and metal wirings electrically attached to each of the scan lines (S1 to Sm) and the data lines (D1 to Dm) of the pixel region are formed in the non-pixel region 100b. In an embodiment, the driver integrated circuit includes a data driving unit 170 and a scan driving unit 180.

[0056] The organic light-emitting diode is driven in an active matrix method, as shown in the drawings, and its configuration will be described in brief. A buffer layer 111 is formed on a deposition substrate 101, and the buffer layer 111 is formed of insulating materials such as silicon oxide (SiO₂) or silicon nitride (SiNx). The buffer layer 111 prevents the substrate 100 from being damaged by factors such as heat from the outside, etc. On at least one region of the buffer layer 111 is formed a semiconductor layer 112 including an active layer 112a and an ohmic contact layer 112b. On the semiconductor layer 112 and the buffer layer 111 is formed a gate insulating layer 113, and on one region of the gate insulating layer 113 is formed a gate electrode 114 having a size corresponding to a width of the active layer 112a.

[0057] An interlayer insulating layer 115 includes the gate electrode 114 and is formed on the gate insulating layer 113, and source and drain electrodes 116a, 116b are formed on a predetermined region of the interlayer insulating layer 115. The source and drain electrodes 116a, 116b are formed so that they can be connected to one exposed region of the ohmic contact layer 112b, and an overcoat 117 includes the source and drain electrodes 116a,116b and is formed on the interlayer insulating layer 115. A first electrode 119 is formed on one region of the overcoat 117, wherein the first electrode 119 is connected with one exposed region of either one of the source and drain electrodes 116a,116b by means of a via hole 118.

[0058] A pixel definition layer 120 includes the first electrode 119 and is formed on the overcoat 117, the pixel definition layer 120 having an opening (not shown) to which at least one region of the first electrode 119 is exposed. An organic layer 121 is formed on the opening of the pixel definition layer 120, and a second electrode layer 122 includes the organic layer 121 and is formed on the pixel definition layer 120. In an embodiment, a passivation layer may be further formed in an upper portion of the second electrode layer 122. However, various modifications and changes may be made in an active matrix structure or a passive matrix structure of the organic light-emitting diode.

[0059] The encapsulation substrate 200, which is equivalent to the top plate 1061, is a member for encapsulating at least one pixel region 100a of the substrate in which the organic light-emitting diode is formed, and is formed of transparent materials in the case of top emission or dual emission and formed of translucent materials in the case of bottom emission. Various materials of the encapsulation substrate 200 can be used in the embodiments of the present invention, but a glass may be preferably used in this embodiment, for example in the case of the top emission, although not limited thereto.

[0060] In an embodiment, the encapsulation substrate 200 is formed in a plate shape in this embodiment, and encapsulates a pixel region in which the organic light-emitting diode is formed on at least the substrate 100. For example, the entire region is encapsulated except a data driving unit and a pad unit in this embodiment. The frit 150 is formed between the encapsulation substrate 200 and the non-pixel region 100b of the substrate 100 to seal the pixel region 100a so that the air or moisture is prevented from being infiltrated.

[0061] In an embodiment, the frit 150 preferably forms a line spaced apart at a constant distance from an edge of an interface in which the encapsulation substrate 200 and the substrate 100 are coalesced to each other. This is to secure a space that forms a reinforcement material 160, as described later. The frit 150 includes a glass material, a absorbing material for absorbing a laser, a filler for reducing a thermal expansion coefficient, etc., and is applied to the encapsulation substrate 200 in a state of frit paste, melted and cured to form the frit seal between the encapsulation substrate 200 and the substrate 100 using a laser or an infrared ray to seal between the encapsulation substrate 200 and the substrate 100. In an embodiment, the line in which the frit 150 is formed preferably has a width of about 0.5 to about 1.5 mm. Also, a height of each frit 150 preferably ranges from about 10 to about 20 μm.

[0062] Meanwhile, various configurations and materials of a surface of the substrate 100 which the frit 150 contacts can be used although not limited thereto. In an embodiment, the frit is not overlapped with a metal wiring as possible as it is, except an area where a metal wiring directly connected with a driver integrated circuit. As described above, if the frit 150 is overlapped with the metal wiring, the metal wiring may be damaged due to irradiation of a laser or an infrared ray.

[0063] The bracket 400 is a kind of a frame for supporting an organic light-emitting panel to which a substrate 100 and an encapsulation substrate 200 are attached. In an embodiment illustrated in FIG. 3, the bracket 400 has a rear wall 450 and a plurality of side walls 460 extending from the rear wall 450. In an embodiment, the bracket does not have a rear wall 450 shown in FIG. 3 and may have a closed loop shape formed by the plurality of side walls 460 shown in FIG. 3. In the embodiment illustrated in FIG. 3, the rear wall 450 of the bracket 400 and a surface of the organic light-emitting panel may be attached with an adhesive tape, etc.

[0064] In an embodiment, the reinforcement material 160 is a member that is formed in a gap between a surface of the organic light-emitting panel and an inner surface of the bracket and then cured, and therefore the reinforcement material 160 prevents an organic light-emitting display device from being easily damaged or broken and also functions as a sealing material when the frit 150 is not attached or its adhesive force is reduced. In an embodiment, curable materials which are naturally cured, thermally cured or UV-cured, may be used. Liquid materials can be used for forming the reinforcement material 160. For example, cyanoacrylate may be used as the naturally cured material; acrylate may be used as the material that is thermally cured at a temperature of about 80° C. or less; and epoxy, acrylate and urethane acrylate may be used as the UV-cured materials.

[0065] Hereinafter, embodiments of a method for preparing an organic light-emitting display device according to the present invention will be described in detail. FIGS. 4a to 4e are process views showing a process for preparing an organic light-emitting display device. Firstly, a frit 150 is applied in a linear shape in a point spaced apart at a predetermined distance from an edge of an encapsulation substrate 200, and the frit 150 is formed in a point corresponding to a non-pixel region 100a of the substrate 100, as described later. In an embodiment, a height of the frit 150 preferably ranges from about 10 to about 20 μm. The frit 150 is applied to the encapsulation substrate 200 at a state of the frit paste, sintered to remove moisture or organic binders that are included in the paste, and then cured.

[0066] Next, a substrate 100 including a pixel region including an organic light-emitting diode, and a non-pixel region in which a driver integrated circuit and a metal wiring, etc. are formed is provided, and an encapsulation substrate 200 is coalesced. In an embodiment, encapsulation substrate 200 may or may not encapsulate a driver integrated circuit of the substrate 100, depending on its design. (FIG. 4b) Next, a laser or an infrared ray is irradiated to the frit 150 between the substrate 100 and the encapsulation substrate 200, both coalesced to each other, to melt the frit 150 between the substrate 100 and the encapsulation substrate 200. In an embodiment, the irradiated laser or infrared ray preferably has, for example, a wavelength of about 800 to about 1200 nm (and preferably about 810 nm), its power preferably ranges from about 25 to about 45 watt, and a region except the frit is preferably masked. A bilayer of cooper and aluminum may be used as materials of the mask. Then, the substrate 100 and the encapsulation substrate 200 are attached to each other by curing the melted frit 150. (FIG. 4c)

[0067] Next, a curable material for forming a reinforcement material 160 is applied, for example by using a dispenser, in an inner wall surface of a bracket 400 for mounting an organic light-emitting panel including the substrate 100 and the encapsulation substrate 200, both attached to each other. Generally, metal materials are mainly used for the bracket 400, although not limited thereto, and plastics are also used for the bracket 400. In an embodiment, the curable material for forming the reinforcement material 160 is preferably applied at a liquid state. (FIG. 4d)

[0068] Next, the organic light-emitting panel or device is mounted on the bracket 400. In an embodiment, the organic light-emitting panel contacts the curable material for the reinforcement material 160 applied in the inner surface of the bracket 400 while it is mounted on the bracket 400, and then the curable material for the reinforcement material 160 moves into a gap between the substrate 100 and the encapsulation substrate 200. (FIG. 4e) In an embodiment, gaps are generated in the edge regions of the substrate 100 and the encapsulation substrate 200 since the frit 150 is not formed adjacent to the edges, but formed spaced apart at a predetermined distance from the edges. Accordingly, the curable material for the reinforcement material 160 moves into the gaps in the edge regions, and then cured. In an embodiment, the dimension of the gap between the substrate 100 and the encapsulation substrate 200 will be identical to the height of the frit, and if a liquid of the reinforcement material is applied on the edges, then the liquid moves into gaps by a capillary phenomenon, and then cured.

[0069] Meanwhile, if the materials of the reinforcement material 160 are naturally cured, then preparation of an organic light-emitting diode may be completed without an additional process, but if the materials of the reinforcement material 160 are UV-cured, then there is required an additional process for masking the reinforcement material 160 and irradiating it with UV ray, and if the materials of the reinforcement material 160 are thermally cured, then there is required an additional process for subjecting the heat to the reinforcement material

[0070] The present invention has been described in detail with reference to embodiments. However, it would be appreciated that modifications and changes might be made in these embodiments without departing from the principles and spirit of the invention. For example, an encapsulation substrate may be prepared in a cap shape, and changes may be easily made in materials of a bracket or frame.

[0071] Although a few embodiments of the present invention have been shown and described, it would be appreciated by those skilled in the art that changes might be made in this embodiment without departing from the principles and spirit of the present invention, the scope of which is defined in the claims and their equivalents.