Method of forming silicon carbide films

[0001] This application is a continuation-in-part of U.S. patent application Ser. No. 10/365,924, filed on 13 Feb. 2003.

[0002] The present invention relates to silicon carbide layers and, more particularly to a method of forming low dielectric constant and low leakage current silicon carbide layers.

[0003] Integrated circuits have evolved into complex devices that include multiple levels of metal layers to electrically interconnect discrete layers of semiconductor devices on a single semiconductor chip. Recently, with the evolution of higher integration and higher density of integrated circuit components, the demand for greater speed of the data transfer rate is required. For this reason, an insulating film having low leakage current, low dielectric constant to give the small RC delay is employed.

[0004] As the dimensions of the integrated circuit components are becoming increasingly denser, the materials used to fabricate such components contribute to the electrical performance of such components. One way to reduce the size of interconnection lines and vias is to change the wiring materials from the conventional aluminum (Al) to copper (Cu) wiring having low electric resistance.

[0005] However, to produce a semiconductor device having multi-layered copper wiring, a low dielectric constant insulating layer is formed as the interlayer insulating film on the copper wiring.

[0006] Furthermore, the use of copper as the interconnect material has various problems. For example, copper is easily diffused into the low dielectric constant insulating film from the copper wiring, thus increasing the leakage current between the upper and lower wiring.

[0007] The use of silicon carbide films as copper diffusion barrier layers has been published in U.S. Pat. No. 5,800,878. The dielectric constant of this film is such as about 5, and in addition it is used as copper diffusion barrier layers for 130 nm-nodes Large Scale Integration (LSI) technologies where the dielectric constant of the interlayer dielectric film is 3.

[0008] For next generation, 100 nm/65 nm-nodes Ultra Large Scale Integration (ULSI) technologies, the reduction of interconnect capacitance is important for suppressing the signal delay as well as the power consumption. Interlayer dielectric films with dielectric constant less than 2.5 are used with copper damascene structures. To decrease the effective dielectric of fine pitched lines, further reduction in the dielectric constant is necessary not only for the inter layer dielectric film itself but also the supporting dielectric films such as hard mask, etch stop layers and copper diffusion barrier layers. Furthermore, to prevent the migration of metal atoms the leakage current of such film at 1 MV/cm has to be less than that of 110⁸ A/cm². Silicon carbide films with dielectric constant less than 4.5 such that the leakage current at 1 MV/cm is less than 110⁸ A/cm are suggested to be suitable to substitute for as such films.

[0009] The method of forming Nitrogen doped silicon carbides (SiCN), oxygen doped silicon carbides (SiCO) has been published in U.S. Patent Application Publication 2001/0030369, U.S. Patent Application Publication 2002/0027286, U.S. Patent Application Publication 2001/0051445, and U.S. Patent Application Publication 2001/0031563. Furthermore; these films have been proposed as copper diffusion barrier layers. Though a nitrogen doped silicon carbide layer has been proposed as a copper diffusion barrier layer with low leakage current, its dielectric constant is 4.5 to 5.0 and this results in significant increases in the effective dielectric of the total dielectric stacks.

[0010] In case of oxygen doped silicon carbide, although its dielectric constant is relatively low, such as less than 5, it cannot sufficiently refrain from increasing the leakage current. To decrease the leakage current to a sufficient level, the oxygen must be introduced much more into the silicon carbide film.

[0011] However, to do so, the leakage current can be reduced up to a satisfactory level, nevertheless a new problem is caused such that the surface of the copper wiring is oxidized and thus the barrier insulating film and the inter dielectric layer is ready to peel.

[0012] Silicon carbide has also been suggested for use of barrier layer on integrated circuits, since silicon carbides can have a low dielectric constant.

[0013] However, the dielectric constant and stress of the conventional silicon carbide film drifts when it is directly exposed to air. This is due to the oxidation of the top surface of the silicon carbide film. The method to minimize the oxidation of carbon containing materials, such as silicon carbide, with an inert gas plasma such as helium (He), Argon (Ar) is published in U.S. Patent Application Publication 2001/0060584. This inert gas plasma treatment only minimizes the top surface of the silicon carbide film from getting oxidized, however, no changes/improvements to the film properties are observed.

[0014] Furthermore, although the dielectric constant is relatively low, such as 4.0, the conventional SiC barrier insulating film cannot sufficiently suppress the increase in the leakage current. In this case, to enough suppress the leakage current, a new method is desired that can produce a barrier layer that is effective in preventing the migration of metal atoms while also exhibiting low dielectric constant and low leakage current.

[0015] Thus, it is desired to develop a new method of forming etch stop layers and copper diffusion barrier layers that can be employed in the next generation, 100 nm/65 nm-nodes Ultra Large Scale Integration (ULSI) technologies, where the copper damascene structures are used.

[0016] The main characteristics of etch stop layers and copper diffusion barrier layers such as silicon carbide films (SiC), nitrogen doped silicon carbide films (SiCN) and oxygen doped silicon carbide films (SiCO) developed using various embodiments of the present invention are as follows:

[0017] a) The dielectric constant is less than 4.5.

[0018] b) No changes to its film properties such as changes to the film stress or changes to film dielectric constant are observed even when directly exposed to air at a room temperature between 20 C. to 30 C.

[0019] c) The leakage current at 1 MV/cm is extremely low, such as less than 110⁷A/cm².

[0020] d) The etch selectivity of SiC to SiOC (as intermediate dielectric), SiCN to SiOC and SiCO to SiOC is higher than 3.

[0021] According to one preferred embodiment of the present invention, a method of forming low dielectric constant and low leakage current silicon carbide film for use in integrated circuit fabrication processes is provided. The silicon carbide film is deposited on a substrate by introducing alkyl silicon compounds such as divinyl-dimethylsilane (Si(CHCH₂)₂(CH₃)₂), tri-methylsilane (SiH(CH₃)₃) or tetra-methylsilane (Si(CH₃)₄) referred to herein as TMS and an inert gas such as argon (Ar), helium (He), krypton (Kr), neon (Ne) or xenon (Xe) in the presence of an electric field in a plasma CVD reactor.

[0022] Silicon carbide based films such as SiCN and SiCO, desired for hard mask, etch stop, or copper diffusion barrier layers, are formed by the plasma enhanced CVD method using the film forming gas containing alkyl silicon compounds and an additional gas such as NH₃ and CO₂ respectively. In addition, O₂, O₃, CH₃OH, C₂H₅OH or H₂O can be used as an additional gas in forming SiCO films. An inert gas commonly employed is He or Ar.

[0023] A mixture of high and low frequency RF power, such that high frequency RF power is in the range of 13.56 MHz to 30 MHz and low frequency RF power is in the range of 200 kHz to 500 kHz, wherein the ratio of low frequency to total power is less than about 0.5, generates the electric field. The leakage current and dielectric constant of the silicon carbide in this invention is decreased by introducing excess amount of inert gas and by invoking a pulsing operation to the RF generator during deposition.

[0024] FIG. 1 is a schematic cross-sectional view of an exemplary plasma chemical vapor deposition device.

[0025] FIG. 2 illustrates a dual damascene structure in which a silicon carbide layer can be used.

[0026] FIG. 3 illustrates an exemplary sequence (deposition recipe) for forming a SiCN film.

[0027] FIG. 4 illustrates an exemplary sequence (deposition recipe) for forming a SiCO film.

[0028] FIG. 5 illustrates an exemplary sequence (deposition recipe) for forming a SiC film.

[0029] FIG. 6A illustrates an ON-OFF pulsed RF power cycle appropriate for use during formation of SiC, SiCN and SiCO films.

[0030] FIG. 6B illustrates a HIGH-LOW pulsed RF power cycle appropriate for use during formation of SiC, SiCN and SiCO films.

[0031] FIG. 7 illustrates a non-continuous deposition technique used in the creation of SiC films.

[0032] Disclosed herein is a method for depositing a silicon carbide film having a low dielectric constant and low leakage current onto a substrate in a CVD chamber, comprising; providing a silicon source, carbon source, and an inert gas in a reaction zone containing a substrate, and reacting the silicon and carbon source in the presence of a plasma to deposit a low dielectric constant and low leakage current silicon carbide film on the substrate.

[0033] A mixture of high and low frequency RF power generates the electric field, wherein the ratio of low frequency to total power is less than about 0.5. The leakage current and dielectric constant in the resulting silicon carbide film is directly related to the carbon concentration, to the amount of inert gas introduced and to the pulse operation of the RF generator during deposition.

[0034] In one preferred embodiment of the present invention, a silicon carbide layer is formed by reacting a gas mixture including, silicon source, carbon source and an inert gas into a plasma enhanced chemical vapor deposition (PECVD) chamber. Details of the processing system are illustrated in FIG. 1.

[0035] FIG. 1 is a schematic cross section of an exemplary plasma CVD device according to a preferred embodiment. A plasma CVD device 1, which is used to form a thin film on a semiconductor wafer 9 or other substrate, comprises a reaction chamber 2, a support 3 provided within the reaction chamber to support the semiconductor wafer 9, a shower-head 4 that is positioned to face the support 3 and is used to jet out reaction gas uniformly onto the semiconductor wafer 9, an outlet 20 to exhaust reaction gases and byproducts from the reaction chamber 2, and a remote plasma discharge chamber 13. The remote plasma discharge chamber 13 is positioned remotely from reaction chamber 2 and is linked to the showerhead 4 via piping 14 and valve 15. The remote plasma discharge chamber 13 has characteristics wherein it generates active species using radio-frequency oscillating output energy of the designated frequency and the piping 14 is made of materials that are not corroded by the active species.

[0036] The support 3 that is provided within the reaction chamber 2 and that is used to place the semiconductor wafer 9 is made of anodized aluminum of aluminum alloy and is grounded 27 to constitute one side of an electrode of plasma discharge. The reaction chamber 2 of the illustrated embodiment is thus a plasma CVD chamber configured for in situ (in chamber) plasma generation. Within the illustrated support 3, a ring-shape heating element 26 is embedded and the semiconductor wafer's temperature is controlled at a predetermined temperature using a temperature controller (not shown). The support 3 is connected to a driving mechanism 25 that moves the support 3 up and down through a support piston 29.

[0037] Within the reaction chamber 2, the showerhead 4 is provided at a position facing the support 3. In the showerhead 4, thousands of fine holes are provided to inject reaction gas onto the semiconductor wafer 9. The showerhead is electrically connected to a radio-frequency oscillator 8 and 8 via matching circuit 10 and constitutes another electrode for plasma discharge. To bring reaction gas to be used for film formation from the showerhead 4, a reaction gas conduit 11 is connected to the piping 14. The number of the gas conduits 11 is not limited to one. According to the type of reaction gas, any number of gas conduits can be installed. One end of the gas conduit 11 constitutes a gas inlet port 5 to cause reaction gas to flow in and the other end constitutes a reaction gas exit port 7 to cause gas to flow out to the showerhead 4. In the middle of the reaction gas conduit 11, a mass flow controller (not shown) and valve 6 are positioned.

[0038] On the side wall of the reaction chamber 2, an outlet 20 is provided. The outlet 20 is connected to a vacuum exhaust pump (not shown) through piping 17. Between the outlet 20 and the vacuum pump, a conductance-controlling valve 21 is provided to regulate pressure within the reaction chamber 2. The conductance-controlling valve 21 is electrically connected to an external regulator. Additionally, a pressure gauge 28a is preferably provided to measure pressure within the reaction chamber 2. This pressure gauge is electrically connected to the regulator 28.

[0039] The silicon and carbon source may be an alkyl silicon compound having a general formula Si_xC_yH_z, where x has a range from 1 to 2, y has a range from 1 to 6, and z has a range from 6 to 20. For example, divinyl-dimethylsilane, tri-methylsilane, and tetra-methylsilane among others maybe used as the alkyl silicon compound. Helium (He), argon (Ar), neon (Ne), krypton (Kr) and xenon (Xe) maybe used for the inert gas.

[0040] The process of forming a silicon carbide film on a 200 mm silicon wafer is explained as follows. In general, the following deposition process parameters can be used to form the silicon carbide layer. The process parameters range from a substrate temperature of about 200 C. to about 400 C. (more preferably 320-350 C.), a chamber pressure of about 300 Pa to 1000 Pa, an alkyl silicon compound flow rate of about 100 sccm to 1000 sccm, an inert gas flow rate of about 200 sccm to 5000 sccm such that the ratio of the inert gas flow rate to alkyl silicon compound is in the range of about 1:1 to about 1:10; and a mixed frequency RF power having at least a first RF power with a frequency in a range of about 13 MHz to 30 MHz (high frequency); and with a power in a range of about 100 Watts to 2000 Watts, and at least a second RF power with a frequency in a range of about 100 kHz to 500 kHz (low frequency); and with a power in the range of about 50 Watts to 500 Watts, wherein the ratio of low frequency to total power is less than about 0.5, and wherein the RF power source generates the electric field. Preferably first RF power is in the range of 300-1000W and second RF power is in the range of 50-250W. Second RF power with a frequency in a range of 300 kHz-450 kHz are preferably used for combination with first RF power.

[0041] The ratio of the second RF power to the total mixed frequency power is preferably less than about 0.5 to 1.0. The above process parameters provide a deposition rate for the silicon carbide layer in the range of about 100 nm/min to 350 nm/min when implemented on a 200 mm substrate in a deposition chamber.

[0042] In addition, during film forming step, the RF power is applied as pulsed energy.

[0043] The details on film forming steps, parameters and RF power applied as pulse energy are explained below.

[0044] As an exemplary process for growing SiCN film on a substrate according to the present invention, the parameters listed in TABLES 1 through 3 were used:

	TABLE 1
	Parameter	Range
	Tetra-methylsilane (TMS) flow rate	100 sccm1000 sccm
	Ammonia (NH3) flow rate	100 sccm1000 sccm
	Helium (He) flow rate	500 sccm10000 sccm
	Pressure	300 Pa1000 Pa
	Primary RF Power	100 W2000 W
	Secondary RF Power	50 W500 W
	Substrate Temperature	200 C.400 C.

[0045]

	TABLE 2
	Parameter	Preferred Range
	Tetra-methylsilane (TMS) flow rate	200 sccm500 sccm
	Ammonia (NH3) flow rate	100 sccm500 sccm
	Helium (He) flow rate	1000 sccm3000 sccm
	Pressure	300 Pa1000 Pa
	Primary RF Power	100 W1000 W
	Secondary RF Power	50 W300 W
	Substrate Temperature	320 C.350 C.

[0046]

	TABLE 3
	Parameter	More Preferred Range
	Tetra-methylsilane (TMS) flow rate	200 sccm300 sccm
	Ammonia (NH3) flow rate	200 sccm300 sccm
	Helium (He) flow rate	2000 sccm3000 sccm
	Pressure	350 Pa700 Pa
	Primary RF Power	500 W700 W
	Secondary RF Power	50 W150 W
	Substrate Temperature	320 C.350 C.

[0047] As an exemplary process for growing SiCO film on a substrate according to the present invention, the parameters listed in TABLES 4 through 6 were used:

	TABLE 4
	Parameter	Range
	Tetra-methylsilane (TMS) flow rate	100 sccm1000 sccm
	Carbon dioxide (CO2) flow rate	1000 sccm10000 sccm
	Helium (He) flow rate	500 sccm10000 sccm
	Pressure	300 Pa1000 Pa
	Primary RF Power	100 W2000 W
	Secondary RF Power	50 W500 W
	Substrate Temperature	200 C.400 C.

[0048]

	TABLE 5
	Parameter	Preferred Range
	Tetra-methylsilane (TMS) flow rate	200 sccm500 sccm
	Carbon dioxide (CO2) flow rate	1000 sccm5000 sccm
	Helium (He) flow rate	1000 sccm3000 sccm
	Pressure	300 Pa1000 Pa
	Primary RF Power	100 W1000 W
	Secondary RF Power	50 W300 W
	Substrate Temperature	320 C.350 C.

[0049]

	TABLE 6
	Parameter	More Preferred Range
	Tetra-methylsilane (TMS) flow rate	200 sccm300 sccm
	Carbon dioxide (CO2) flow rate	1500 sccm2500 sccm
	Helium (He) flow rate	1000 sccm2500 sccm
	Pressure	300 Pa700 Pa
	Primary RF Power	400 W600 W
	Secondary RF Power	50 W150 W
	Substrate Temperature	320 C.350 C.

[0050] As an exemplary process for growing SiC film on a substrate according to the present invention, the parameters listed in TABLES 7 through 9 were used:

	TABLE 7
	Range
Parameter	Step 1	Step 2
Tetra-methylsilane	100 sccm1000 sccm	0 sccm500 sccm
(TMS) flow rate
Helium (He) flow	100 sccm10000 sccm	100 sccm10000 sccm
rate
Pressure	300 Pa1000 Pa	300 Pa1000 Pa
Primary RF Power	100 W2000 W	100 W2000 W
Secondary RF	50 W500 W	50 W500 W
Power
Substrate	200 C.400 C.	200 C.400 C.
Temperature

[0051]

	TABLE 8
	Preferred Range
Parameter	Step 1	Step 2
Tetra-methylsilane	100 sccm700 sccm	0 sccm300 sccm
(TMS) flow rate
Helium (He) flow rate	100 sccm3000 sccm	100 sccm5000 sccm
Pressure	300 Pa1000 Pa	300 Pa1000 Pa
Primary RF Power	100 W1000 W	100 W1000 W
Secondary RF Power	50 W300 W	50 W300 W
Substrate Temperature	250 C.350 C.	250 C.350 C.

[0052]

	TABLE 9
	More Preferred Range
Parameter	Step 1	Step 2
Tetra-methylsilane	100 sccm500 sccm	0 sccm100 sccm
(TMS) flow rate
Helium (He) flow rate	100 sccm1000 sccm	100 sccm2500 sccm
Pressure	300 Pa700 Pa	300 Pa700 Pa
Primary RF Power	350 W500 W	350 W500 W
Secondary RF Power	50 W150 W	50 W150 W
Substrate Temperature	300 C.350 C.	300 C.350 C.

[0053] To deposit SiCN layer on 200 mm wafer, a reactive gas source such as tetra-methylsilane (TMS) and a substantial source of nitrogen such as ammonia (NH3) is introduced into the reaction zone. Helium can be used as an inert gas. See TABLES 1 through 3 for gas flow rates. The chamber is maintained preferably at about 300 to 700 Pa, more preferably maintained at 600 Pa. A mixed frequency of 27.12 MHz and 400 kHz RF power source preferably delivers at least about 100 Watts to 2000 Watts and at least about 50 Watts to 500 Watts respectively. More preferably 27.12 MHz RF power of 575W and 400 kHz RF power of 100W is applied for forming films.

[0054] A basic film is formed on the substrate by flowing TMS, NH₃, He and applying RF power as shown in FIG. 3 (TMS250 sccm; NH₃250 sccm; He2.5 slm; 27.12 MHz at 575W; 400 kHz at 75W; substrate temperature365 C.; chamber pressure600 Pa).

[0055] The basic film properties of the SiCN film deposited above are shown in TABLE 10. Furthermore, no major changes either to dielectric constant or to stress of this film were observed even when exposed to air at room temperature of 20 C. to 30 C.

[0056] To deposit SiCO layer on 200 mm wafer, a reactive gas source such as tetra-methylsilane (TMS) and a substantial source of oxygen such as carbon dioxide (CO₂) is introduced into the reaction zone. An inert gas such as helium is also flown into the chamber. See TABLES 4 through 6 for gas flow rates. The chamber is maintained preferably at about 300 to 700 Pa, more preferably maintained at 533 Pa. A mixed frequency of 27.12 MHz and 400 kHz RF power source preferably delivers at least about 100 Watts to 2000 Watts and at least about 50 Watts to 500 Watts respectively. More preferably 27.12 MHz RF power of 450W and 400 kHz RF power of 100W is applied for forming films.

[0057] A basic film is formed on the substrate by flowing TMS, CO₂, He and applying RF power as shown in FIG. 4 (TMS300 sccm; He2.5 slm; CO₂1.9 slm; 27.12 MHz at 450W; 400 kHz at 100W; substrate temperature365 C.; chamber pressure533 Pa).

[0058] The basic film properties of the SiCO film deposited above are shown in TABLE 10. Furthermore, no major changes either to dielectric constant or to stress of this film were observed even when it has direct contact to air at room temperature of 20 C. to 30 C.

[0059] To deposit SiC layer on 200 mm wafer, a reactive gas source such as tetra-methylsilane (TMS) is introduced into the reaction zone. Helium is used as an inert gas. See TABLES 7 through 9 for gas flow rates. The chamber is maintained preferably at about 300 to 700 Pa, more preferably maintained at 600 Pa. A mixed frequency of 27.12 MHz and 400 kHz RF power source preferably delivers at least about 100 Watts to 2000 Watts and at least about 50 Watts to 500 Watts respectively. More preferably 27.12 MHz RF power of 400W and 400 kHz RF power of 150W is applied for forming films.

[0060] SiC film deposition steps are divided into 2 steps. First, basic film is formed on the substrate by flowing TMS, He and applying RF power as shown in FIG. 5 (TMS300 sccm; He500 slm; 27.12 MHz at 400W; 400 kHz at 150W; substrate temperature340 C.; chamber pressure600 Pa).

[0061] Second, an active plasma treatment step is performed. After the basic film formation step, second film formation is carried out continuously. In this step, Helium flow is increased and TMS flow is decreased without changing plasma discharge. One has to consider that the film formation is continued during the active plasma treatment (TMSRamp down to 0 sccm; HeRamp up to 2.5 slm; 27.12 MHz at 400W; 400 kHz at 150W; substrate temperature340 C.; chamber pressure600 Pa).

[0062] The basic film properties of the SiC film deposited using the above steps and conditions are shown in TABLE 10.

[0063] A SiC film deposited by the basic film forming step alone is not stable, its film stress and dielectric constant changes when exposed to air at room temperature. This is due to the oxidation of the surface layer. The method of minimizing the oxidation of carbon containing films, such as SiC is published in U.S. Patent Application Publication 2002/054962, however, no changes/improvements to the film properties are observed. Furthermore, when annealing is performed at 400 C. under nitrogen atmosphere for 10 hours, a drastic change in the film stress is observed. The change in the stress is about 400 MPa, which consequently implies to a poor thermal stress stability behavior. Due to this, a new problem arises such as a barrier insulating film and the inter dielectric layer is ready to peel off.

[0064] When an active plasma treatment in this invention is performed on the SiC films, the unstable phenomena of the film stress and dielectric constant are solved. Also the dielectric constant and leakage current is decreased. Furthermore, after annealing at 400 C. under nitrogen atmosphere for 10 hours, almost no changes to the film properties are observed, except for a small change in the film stress. It is presumed that the SiC film deposited according to the embodiments described above has a good thermal stress behavior. It can also be presumed that the active plasma treatment gives good adhesion behavior between barrier insulating film and inter dielectric layer.

[0065] The silicon carbide films deposited by the PECVD process described herein have significantly lower dielectric constant and lower leakage current in comparison to the conventional silicon carbide films. The silicon carbide films can be deposited without a mixture of low and high frequency. However, the preferred mixture of high and low radio frequency corrects adverse film properties caused by the bombardment of the silicon carbide film with molecules of inert gas. Increasing the ratio of SiC bonds in the film provides greater hardness and high elastic modulus in the silicon carbide film.

[0066] The following examples illustrate additional preferred embodiments. In particular, the following example demonstrates deposition of nitrogen doped silicon carbide (SiCN), oxygen doped silicon carbide (SiCO), and silicon carbide (SiC) films having excellent copper diffusion barrier and etch stop properties.

[0067] SiCN film is deposited on a 200 mm wafer by introducing tetra-methylsilane (TMS), ammonia (NH₃) and helium as inert gas into the reaction zone. (See TABLES 1,2 and 3 for gas flow rates). The chamber is maintained preferably at about 300 to 700 Pa, more preferably maintained at 600 Pa. The substrate is placed on top plate, approximately 14 to 20 mm from the showerhead and 50 to 500 watts of pulsed high frequency power of 27.12 MHz, 50 to 100 Watts of 400 kHz low frequency power is applied to the showerhead for plasma enhanced deposition of SiCN films. The on-time, (t₁) is from 0.1 to 20 sec and off-time, (t₂) is from 0.1 to 10 sec. More preferably the on-time is from 0.1 to 10 sec and off-time is from 0.1 to 5 sec. The ON-OFF pulse sequence/time interval is illustrated in FIG. 6A. H-L pulse operation mode can also be employed to get the same result as the ON-OFF pulse operation mode. H refers to the high power values (P₁) (maximum power employed to the plasma discharge electrode during film forming), and L refers to the low power values (P₂) (minimum power employed to the plasma discharge electrode during film forming). H-L pulse sequence/time interval is illustrated in FIG. 6B. The film properties of the deposited SiCN such as dielectric constant, leakage current at 1 MV/cm, film stress is shown in TABLE 10.

[0068] SiCO film is deposited on a 200 mm wafer by introducing tetra-methylsilane, carbon dioxide and helium as inert gas into the reaction zone. (See TABLES 4,5, and 6 for gas flow rates). The chamber is maintained preferably at about 300 to 700 Pa, more preferably maintained at 533 Pa. The substrate is placed on top plate, approximately 14 to 20 mm from the showerhead and 50 to 500 watts of pulsed high frequency power of 27.12 MHz, 50 to 100 Watts of 400 kHz low frequency power is applied to the showerhead for plasma enhanced deposition of SiCO films. The on-time (t₁) is from 0.1 to 20 sec and off-time (t₂) is from 0.1 to 10 sec. More preferably the on-time is from 0.1 to 10 sec and off-time is from 0.1 to 5 sec. The ON-OFF pulse sequence/time interval is illustrated in FIG. 6A. H-L pulse operation mode can also be employed to get the same result as the ON-OFF pulse operation mode. H refers to the high power values (P₁) (maximum power employed to the plasma discharge electrode), and L refers to the low power values (P₂) (minimum power employed to the plasma discharge electrode). H-L pulse sequence/time interval is illustrated in FIG. 6B. The film properties of the deposited SiCO such as dielectric constant, leakage current at 1 MV/cm, film stress is shown in TABLE 10.

[0069] SiC film is deposited on a 200 mm wafer by introducing tetra-methylsilane and helium as inert gas into the reaction zone. (See TABLES 7,8 and 9 for gas flow rates). The chamber is maintained preferably at about 300 to 1000 Pa, more preferably maintained at 600 Pa. The substrate is placed on top plate, approximately 14 to 20 mm from the showerhead and 50 to 500 watts of pulsed high frequency power of 27.12 MHz, 50 to 100 Watts of 400 kHz low frequency power is applied to the showerhead for plasma enhanced deposition of SiC films. The on-time (t₁) is from 0.1 to 20 sec and off-time (t₂) is from 0.1 to 10 sec. More preferably the on-time is from 0.1 to 10 sec and off-time is from 0.1 to 5 sec. The ON-OFF pulse sequence/time interval is illustrated in FIG. 6A. H-L pulse operation mode can also be employed to get the same result as the ON-OFF pulse operation mode. H refers to the high power (P₁) (maximum power employed to the plasma discharge electrode) values, and L refers to the low power values (P₂) (minimum power employed to the plasma discharge electrode). H-L pulse sequence/time interval is illustrated in FIG. 6B. The film properties of the deposited SiC such as dielectric constant, leakage current at 1 MV/cm, film stress is shown in TABLE 10.

[0070] FIG. 2 shows a dual damascene structure in which a silicon carbide layer can be used. A copper (Cu) layer (1) is first covered with a silicon carbide Dielectric Diffusion Barrier (DDB) (2). Before depositing the DDB, the Cu surface can be improved by removing of any copper oxide that may be remaining on the surface. Typically a hydrogen (H₂) or an ammonia (NH₃) or methane (CH₄) plasma based reduction is used before the deposition of DDB (2). This copper surface reduction to remove CMP residue can be performed in a PECVD chamber.

[0071] On top of Cu (1), the silicon carbide DDB layer (2) is deposited. After the deposition of DDB layer (2), inter level dielectric, in this case SiOC layer (3), is deposited. The thickness of SiOC layer (3) is approximately the height of via (4). SiOC layer (3) is patterned and etched to create via hole. The portion of DDB layer (2) over via hole is also etched to expose the underlying metal line. A silicon carbide etch stop layer (5) is deposited over SiCO layer (3), where the thickness of SiOC layer (3) is approximately the height of via (4). SiOC layer (3) is patterned and etched to create the via hole. The portion of DDB layer (2) over via hole is also etched to expose the underlying metal line. A silicon carbide etch stop layer (5) is deposited over SiOC layer. Then second SiOC layer (6) is deposited. Etching and patterning the second SiCO layer (6) creates the trench. Silicon carbide etch stop layer (5) prevents the etching of second SiOC layer (6) from continuing into first SiOC layer (3).

[0072] A silicon carbide layer can also be deposited as a passivation layer (not shown) for protecting the device from scratching. The silicon carbide dielectric diffusion barrier (DDB) layer is important as it effectively prevents copper diffusion into the SiOC layers. This is due to the DDB layer having a low leakage current.

[0073] The amount of leakage current of conventional silicon carbide barrier layer at 1 MV/cm is approximately 110⁷ A/cm² compared to that of approximately 11⁹ A/cm² in a silicon carbide barrier layer fabricated as described herein. Thus, using a conventional silicon carbide barrier layer, as opposed to a silicon carbide layer fabricated as described herein, at an electric field of 2 MV/cm, maintains the same effectiveness in preventing the copper diffusion. Furthermore, the resulting silicon carbide layer has a relatively low dielectric constant, typically around 3.5 and 4.0, depending on the mixture and ratio of low frequency to the total frequency generated during deposition, and also depending on the ratio of gases used to form the silicon carbide.

[0074] The same method can be employed to deposit a nitrogen doped silicon carbide and oxygen doped silicon carbide. As a result, both the nitrogen doped silicon carbide and oxygen doped silicon carbide deposited by the PECVD process in this invention have a lower leakage current in comparison to the conventional nitrogen doped silicon carbide and the conventional oxygen doped silicon carbide respectively. Similar to silicon carbide films, the leakage current -in the resulting nitrogen doped silicon carbide films and in oxygen doped silicon carbide films are related to the carbon concentration, to the amount of inert gas introduced and to the pulse operation of the RF generator during deposition.

[0075] An as-deposited silicon carbide layer has a dielectric constant and leakage current at 1 MV/cm less than about 4.0 and 110⁹ A/cm², respectively, making it suitable for use as an insulating material in integrated circuits. The dielectric constant of the silicon carbide layer is tunable, in that it can be varied as a function of the ratio of the mixed frequency RF powers. In particular, as the ratio of the low frequency RF power to the total mixed powers decreases, the dielectric constant of the silicon carbide layer also decreases.

[0076] The dielectric constant of the silicon carbide layer can also be tuned as a function of the composition of the gas mixture during layer formation. As the carbon concentration in the gas mixture increases, the carbon content of the as-deposited silicon carbide layer increases, making the silicon carbide film less dense and dielectric constant decrease. Also, as the carbon concentration of the as deposited silicon carbide layer increases, the hydrophobic properties thereof increases making such layers suitable for use as moisture barriers in integrated circuits.

[0077] Furthermore, the leakage current and dielectric constant of the silicon carbide layer in this invention has decreased by invoking a pulse operation to the RF power. The on-time (t₁) is from 0.1 to 20 sec and off-time (t₂) is from 0.1 to 10 sec. Most preferably the on-time is from 0.1 to 10 sec and off-time is from 0.1 to 5 sec. The ON-OFF pulse sequence/time interval is illustrated in FIG. 6A. H-L pulse operation mode can also be employed to get the same result as the ON-OFF pulse operation mode. H refers to the high power values (P1) (maximum power employed to the plasma discharge electrode), and L refers to the low power values (P2) (minimum power employed to the plasma discharge electrode). H-L pulse sequence/time interval is illustrated in FIG. 6B. The film properties of the deposited SiC such as dielectric constant, leakage current at 1 MV/cm, film stress is shown in TABLE 10.

[0078] Also, similar results can be obtained by introducing a non-continuous deposition method. Non-continuous deposition refers to turning the plasma on and off randomly by turning the RF power on and off as shown in FIG. 7.

[0079] In addition, the as-deposited silicon carbide layer has no oxygen content. It is believed that such an oxygen free silicon carbide layer minimizes metal diffusion and improves the barrier layer properties. For example, the as-deposited silicon carbide layer has a current blocking ability at 1 MV/cm that is less than that about 110⁹ A/cm², which is suitable for minimizing cross-talk between integrated circuit interconnect structures.

[0080] The etching performance of silicon carbide, nitrogen doped silicon carbide and oxygen doped silicon carbide materials shows that the etch selectivity, based on RIE (reactive ion etching) etching mode, between SiOC and silicon carbide described herein was from 5 to 15. The etch selectivity between SiOC and nitrogen doped silicon carbide described herein was from 4 to 5. The etch selectivity between SiOC and oxygen doped silicon carbide described herein was from 4 to 10. Superior performance exists for SiCN, SiCO and SiC on etching selectivity.

	TABLE 10
	Film Stress		Leakage current at 1 MV/cm
	Compressive	Dielectric	Without pulse	With pulse
Film type	(MPa)	constant	energy	energy
SiCN	240 to 260	4.5	2 109	3 1010
SiCO	230 to 250	4.3	3 109	4 1010
SiC	50 to 100	3.8	3 108	1 109