Multilayer ceramic capacitor

[0001] This application claims the benefit of priority to Japanese Patent Application No. 2022-130759 filed on Aug. 18, 2022 and is a Continuation application of PCT Application No. PCT/JP2023/020658 filed on Jun. 2, 2023. The entire contents of each application are hereby incorporated herein by reference.

[0002] The present invention relates to multilayer ceramic capacitors.

[0003] Conventionally, multilayer ceramic capacitors have been known. Typical multilayer ceramic capacitors each have a substantially rectangular parallelepiped multilayer body having the dimension in the length direction L longer than the dimension in the width direction W, and external electrodes are provided at both ends of the multilayer body in the length direction L. On the other hand, there are also known so-called LW reversed type multilayer ceramic capacitors in each of which the dimensional relationship between the dimension in the length direction L and the dimension in the width direction W of the multilayer body is reversed in order to reduce ESL (for example, refer to Japanese Unexamined Patent Application Publication Nos. 2020-57753 and 2020-61524).

[0004] Further, in recent years, as the mounting density of the substrate increases, the mounting area of the multilayer ceramic capacitor decreases. Therefore, there is an increasing demand for multilayer ceramic capacitors in each of which a package-on-package (PoP) mounting is adopted and a land side capacitor (LSC) type mounting is performed on a lower end portion of a substrate. As multilayer ceramic capacitors in each of which such a land side capacitor (LSC) type mounting is performed, thin multilayer ceramic capacitors each having a reduced height in the height direction are required.

[0005] Japanese Unexamined Patent Application Publication No. 2020-61524 discloses an LW reversed type multilayer ceramic electronic component. In the LW reversed type multilayer ceramic electronic component, at least one edge of the fourth surface portion and the fifth surface portion of an external electrode has a recess portion recessed from the edge toward the first surface portion, and both lateral portions of the recess portion in the third direction function as a covering portion covering the ridges of the two surfaces in the second direction of the component body.

[0006] However, in the multilayer ceramic electronic component disclosed in Japanese Unexamined Patent Application Publication No. 2020-61524, it is presumed that, due to the formation position, thickness variation, etc. of a base conductor layer and a covering conductor layer provided on the base conductor layer, the area and the shape of the covering portion covering the ridges of the two surfaces in the second direction of the component body vary. Here, when mounting an LW reversed type multilayer ceramic electronic component using solder on the mounting board, depending on the lateral differences in the area and shape of the covering portion, the wetting manner of the solder with respect to the coating portion is changed on each surface, and there is a possibility that a difference occurs in the addition of the tensile stress of the solder. This may deteriorate the self-alignment effect. As a result, the multilayer ceramic electronic component may tend to rotate or tilt, which may deteriorate the mountability. Furthermore, the lands of the board on which an LW reversed type multilayer ceramic electronic component is mounted have short distances therebetween. Therefore, there is a possibility that the self-alignment effect is deteriorated. When the multilayer ceramic electronic component is greatly rotated, one external electrode is mounted on lands having different polarities in a manner straddling the lands, and there is a possibility that a short-circuit failure occurs.

[0007] Example embodiments of the present invention provide LW reversed type multilayer ceramic capacitors that are each able to reduce or prevent deterioration of a self-alignment effect and perform stable mounting.

[0008] An example embodiment of the present invention provides a multilayer ceramic capacitor that includes a multilayer body including a plurality of dielectric layers and a plurality of internal electrode layers that are alternately laminated in a height direction, the multilayer body further including a first main surface and a second main surface which oppose each other in the height direction, a first end surface and a second end surface which oppose each other in a length direction perpendicular or substantially perpendicular to the height direction, and a first lateral surface and a second lateral surface which oppose each other in a width direction perpendicular or substantially perpendicular to the height direction and the length direction, a first external electrode including a first surface portion located on the first end surface, at least one selected from a second surface portion located on a portion of the first main surface and a third surface portion located on a portion of the second main surface, a fourth surface portion located on a portion of the first lateral surface, and a fifth surface portion located on a portion of the second lateral surface, and a second external electrode including a sixth surface portion located on the second end surface, at least one selected from a seventh surface portion located on a portion of the first main surface and an eighth surface portion located on a portion of the second main surface, a ninth surface portion located on a portion of the first lateral surface, and a tenth surface portion located on a portion of the second lateral surface, in which, in a case in which a dimension in the length direction between the first end surface and the second end surface of the multilayer body is defined as l, a dimension in the width direction between the first lateral surface and the second lateral surface of the multilayer body is defined as w, and a dimension in the height direction between the first main surface and the second main surface of the multilayer body is defined as t, a dimensional relationship of w>l>t is satisfied, a dimension in the length direction of each of the fourth surface portion and the fifth surface portion of the first external electrode is larger than a dimension in the length direction of each of the second surface portion and the third surface portion of the first external electrode, and a dimension in the length direction of each of the ninth surface portion and the tenth surface portion of the second external electrode is larger than a dimension in the length direction of each of the seventh surface portion and the eighth surface portion of the second external electrode.

[0009] According to example embodiments of the present invention, it is possible to provide LW reversed type multilayer ceramic capacitors that are each able to reduce or prevent deterioration of a self-alignment effect and perform stable mounting.

[0010] The above and other elements, features, steps, characteristics and advantages of the present invention will become more apparent from the following detailed description of the example embodiments with reference to the attached drawings.

[0038] Hereinafter, multilayer ceramic capacitors according to example embodiments of the present disclosure will be described. FIG. 1 is an external perspective view of the multilayer ceramic capacitor 1 according to an example embodiment of the present invention. FIG. 2 is an arrow view when viewing a first lateral surface WS1 of the multilayer ceramic capacitor 1 shown in FIG. 1 along the direction of the arrow II. FIG. 3 is an arrow view when viewing a second lateral surface WS2 of the multilayer ceramic capacitor 1 shown in FIG. 1 along the direction of the arrow III. FIG. 4 is an arrow view when viewing a first main surface TS1 of the multilayer ceramic capacitor 1 shown in FIG. 2 along the direction of the arrow IV. FIG. 5 is an arrow view when viewing a second main surface TS2 of the multilayer ceramic capacitor 1 shown in FIG. 2 along the direction of the arrow V. FIG. 6 is a cross-sectional view taken along the line VI-VI of the multilayer ceramic capacitor 1 shown in FIG. 4. FIG. 7 is a cross-sectional view taken along the line VII-VII of the multilayer ceramic capacitor 1 shown in FIG. 6. FIG. 8A is a cross-sectional view taken along the line VIIIA-VIIIA of the multilayer ceramic capacitor 1 shown in FIG. 6. FIG. 8B is a cross-sectional view taken along the line VIIIB-VIIIB of the multilayer ceramic capacitor 1 shown in FIG. 6. FIG. 9 is a cross-sectional view taken along the line IX-IX of the multilayer ceramic capacitor 1 shown in FIG. 4, and is a view showing a first lateral surface WS1 of the multilayer body 10. FIG. 10A is an enlarged view of an XA portion in FIG. 6, and shows a cross section of a first external electrode 40A. FIG. 10B is an enlarged view of an XB portion in FIG. 6, and shows a cross section of a second external electrode 40B.

[0039] The multilayer ceramic capacitor 1 includes a multilayer body 10 and external electrodes 40.

[0040] FIGS. 1 to 9 each show the XYZ Cartesian coordinate system. The length direction L of the multilayer ceramic capacitor 1 and the multilayer body 10 corresponds to the Y-direction. The width direction W of the multilayer ceramic capacitor 1 and the multilayer body 10 corresponds to the X-direction. The height (lamination) direction T of the multilayer ceramic capacitor 1 and multilayer body 10 corresponds to the Z-direction. The cross section shown in FIG. 6 is also referred to as an LT cross section. The cross section shown in FIG. 7 is also referred to as a WT cross section. The cross-sections shown in FIG. 8A and FIG. 8B are also referred to as an LW cross section.

[0041] As shown in FIGS. 1 to 5, the multilayer body 10 includes a first main surface TS1 and a second main surface TS2 opposing in the height direction T, a first end surface LS1 and a second end surface LS2 opposing in the length direction L orthogonal or substantially orthogonal to the height direction T, and a first lateral surface WS1 and a second lateral surface WS2 opposing in the width direction W orthogonal or substantially orthogonal to the height direction T and the length direction L.

[0042] The multilayer body 10 has a rectangular or substantially rectangular parallelepiped shape. It is preferable that the corners and ridges of multilayer body 10 are rounded. The corners are portions where the three surfaces of the multilayer body intersect, and the ridges are portions where the two surfaces of the multilayer body intersect. Irregularities or the like may be provided on a portion or all of the surface of the multilayer body 10, for example.

[0043] As shown in FIGS. 6 and 7, the multilayer body 10 includes an inner layer portion 11, and a first main surface-side outer layer portion 12 and a second main surface-side outer layer portion 13 that sandwich the inner layer portion 11 in the height direction T.

[0044] The inner layer portion 11 includes a plurality of dielectric layers 20 and a plurality of internal electrode layers 30. The inner layer portion 11 includes the internal electrode layers 30 from the internal electrode layer 30 located the most to the first main surface TS1 side to the internal electrode layer 30 located on the most second main surface TS2 side in the height direction T. In the inner layer portion 11, the plurality of internal electrode layers 30 are opposed to each other with a dielectric layer 20 interposed therebetween. The inner layer portion 11 generates capacitance, and substantially defines and functions as a capacitor. The inner layer portion 11 is also referred to as an active layer portion.

[0045] The plurality of dielectric layers 20 includes a dielectric material. The dielectric material is a ceramic material, for example. The dielectric material may be a dielectric ceramic including components such as BaTiO₃, CaTiO₃, SrTiO₃ or CaZrO₃. When these components are the main components, sub-components having a content smaller than that of the main components, such as a Mn compound, an Fe compound, a Cr compound, a Co compound, and a Ni compound, may be added depending on the characteristics of a desired multilayer body.

[0046] The thickness of the dielectric layer 20 is preferably about 0.5 μm or more and about 10 μm or less, for example. The number of dielectric layers 20 to be laminated is preferably 15 or more and 700 or less, for example. The number of the dielectric layers 20 is the total number of dielectric layers in the inner layer portion 11 and the number of dielectric layers in the first main surface-side outer layer portion 12 and the second main surface-side outer layer portion 13.

[0047] The plurality of internal electrode layers 30 have a plurality of first internal electrode layers 31 and a plurality of second internal electrode layers 32. The first internal electrode layers 31 are provided on the plurality of dielectric layers 20 and extend to the first end surface LS1. The second internal electrode layers 32 are provided on the plurality of dielectric layers 20 and extend to the second end surface LS2. The plurality of first internal electrode layers 31 and the plurality of second internal electrode layers 32 are alternately provided in the height direction T of the multilayer body 10 with the dielectric layer 20 interposed therebetween. The first internal electrode layer 31 and the second internal electrode layer 32 are arranged so as to sandwich the dielectric layer 20.

[0048] As shown in FIG. 8A, the first internal electrode layers 31 each includes a first counter electrode portion 31A and a first extension portion 31B. The first counter electrode portion 31A is opposed to the second internal electrode layer 32. The first extension portion 31B extends from the first counter electrode portion 31A to the first end surface LS1, a portion of the first lateral surface WS1, and a portion of the second lateral surface WS2. The first counter electrode portion 31A is located inside the multilayer body 10. The first extension portion 31B is connected to the first counter electrode portion 31A, and exposed at the first end surface LS1, a portion of the first lateral surface WS1, and a portion of the second lateral surface WS2.

[0049] With such a configuration, since the width of the first extension portion 31B of the first internal electrode layer 31 can be maintained, it is possible to increase the connection area between the first extension portion 31B and the first external electrode 40A, and thus it is possible to enlarge the electric current path. As a result, it is possible to reduce ESL. In addition, since the first extension portion 31B of the first internal electrode layer 31 is provided on a portion of the first lateral surface WS1 and the second lateral surface WS2 of the multilayer body 10, it is possible to reduce the distance between the first extension portion 31B and a second extension portion 32B of the second internal electrode layer 32, which will be described later, and thus it is possible to reduce ESL.

[0050] As shown in FIG. 8B, the second internal electrode layer 32 includes a second counter electrode portion 32A and a second extension portion 32B. The second counter electrode portion 32A is opposed to the first internal electrode layer 31. The second extension portion 32B extends from the second counter electrode portion 32A to the second end surface LS2, a portion of the first lateral surface WS1, and a portion of the second lateral surface WS2. The second counter electrode portion 32A is located inside the multilayer body 10. The second extension portion 32B is connected to the second counter electrode portion 32A, and exposed at the second end surface LS2, a portion of the first lateral surface WS1, and a portion of the second lateral surface WS2.

[0051] With such a configuration, since the width of the second extension portion 32B of the second internal electrode layer 32 can be maintained, it is possible to increase the connection area between the second extension portion 32B and the second external electrode 40B, and thus it is possible to enlarge the electric current path. As a result, it is possible to reduce ESL. In addition, since the second extension portion 32B of the second internal electrode layer 32 is provided on a portion of the first lateral surface WS1 and the second lateral surface WS2 of the multilayer body 10, it is possible to reduce the distance between the second extension portion 32B and the first extension portion 31B of the first internal electrode layer 31, and thus it is possible to reduce ESL.

[0052] FIG. 9 is a cross-sectional view taken along the line IX-IX of the multilayer ceramic capacitor 1 shown in FIG. 4, and shows the first lateral surface WS1 of the multilayer body 10. In each of FIGS. 8A and 8B, a line IX-IX indicating the position of the cross-sectional view of FIG. 9 is shown. As shown in FIG. 9, the first extension portion 31B of the first internal electrode layer 31 and the second extension portion 32B of the second internal electrode layer 32 are exposed at the first lateral surface WS1 of the multilayer body 10.

[0053] As shown in FIG. 9, the dimension in the length direction L of each of the plurality of first extension portions 31B provided along the height direction T is larger than the dimension in the length direction L of a second surface portion 40A2 and a third surface portion 40A3 of the first external electrode 40A, which will be described later.

[0054] Further, the same applies to the plurality of second extension portions 32B provided along the height direction T of the second internal electrode layer 32. The dimension in the length direction L of each of the plurality of second extension portions 32B is larger than the dimension in the length direction L of a seventh surface portion 40B2 and an eighth surface portion 40B3 of the second external electrode 40B, which will be described later.

[0055] Although not shown, the first extension portion 31B of the first internal electrode layer 31 and the second extension portion 32B of the second internal electrode layer 32 are exposed at the second lateral surface WS2 in the same manner as those at the first lateral surface WS1. Similarly to those at the first lateral surface WS1, the dimension in the length direction L of each of the plurality of first extension portions 31B is larger than the dimension in the length direction L of each of the second surface portion 40A2 and the third surface portion 40A3 of the first external electrode 40A at the second lateral surface WS2 as well. Further, the dimension in the length direction L of each of the plurality of second extension portions 32B is larger than the dimension in the length direction L of each of the seventh surface portion 40B2 and the eighth surface portion 40B3 of the second external electrode 40B.

[0056] Each of the first extension portion 31B and the second extension portion 32B includes a portion exposed at a portion of the first lateral surface WS1. The dimension in the length direction L of the portion exposed at a portion of the first lateral surface WS1 is preferably about 30 μm or more and about 230 μm or less, for example. Each of the first extension portion 31B and the second extension portion 32B includes a portion exposed at a portion of the second lateral surface WS2. The dimension in the length direction L of the portion exposed at a portion of the second lateral surface WS2 is preferably about 30 μm or more and about 230 μm or less, for example. The dimensions of the extension portions exposed at these lateral surfaces of the multilayer body 10 may be equal or substantially equal to each other.

[0057] With such a configuration, it is possible to achieve the shape of the first external electrode 40A including a fourth surface portion 40A4 and a fifth surface portion 40A5, which are described later, and the shape of the second external electrode 40B including a ninth surface portion 40B4 and a tenth surface portion 40B5, which are described later. Since it is possible to reduce the distance between the first extension portions 31B of the first internal electrode layers 31 and the second extension portions 32B of the second internal electrode layers 32, it is possible to reduce the electric current path. Therefore, it is possible to reduce ESL.

[0058] In the present example embodiment, capacitance is generated by each of the first counter electrode portions 31A and each of the second counter electrode portions 32A being opposed to each other with the dielectric layer 20 interposed therebetween, such that the characteristics of the capacitor are developed.

[0059] The shapes of each of the first counter electrode portions 31A and each of the second counter electrode portions 32A are not particularly limited, but are preferably rectangular or substantially rectangular. The corner portions in the rectangular shape may be rounded, or the corner portion in the rectangular shape may be obliquely chamfered.

[0060] The shapes of each of the first extension portions 31B and each of the second extension portions 32B are not particularly limited, but are preferably rectangular. The corner portion of the rectangular shape may be rounded, or the corner portion of the rectangular shape may be obliquely chamfered. In the present example embodiment, the shapes of each of the first extension portions 31B and each of the second extension portions 32B are substantially T-shaped in which a portion of the corner portion in the rectangular shape is removed.

[0061] The dimension in the width direction W of the portion of each of the first extension portions 31B exposed at the first end surface LS1 is larger than the dimension in the width direction W of each of the first counter electrode portions 31A. The dimension in the width direction W of the portion of each of the second extension portions 32B exposed at the second end surface LS2 is larger than the dimension in the width direction W of each of the second counter electrode portions 32A.

[0062] The first internal electrode layer 31 and the second internal electrode layer 32 are each made of an appropriate electrically conductive material including a metal such as Ni, Cu, Ag, Pd, and Au, and an alloy including at least one selected from these metals. When an alloy is used, the first internal electrode layer 31 and the second internal electrode layer 32 may be made of, for example, a Ag—Pd alloy.

[0063] The thickness of each of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably, for example, about 0.2 μm or more and 2.0 μm or less. The total number of the first internal electrode layers 31 and the second internal electrode layers 32 is preferably 15 or more and 200 or less.

[0064] The first main surface-side outer layer portion 12 is located on the first main surface TS1 side of the multilayer body 10. The first main surface-side outer layer portion 12 is an assembly of a plurality of dielectric layers 20 located between the first main surface TS1 and the internal electrode layer 30 closest to the first main surface TS1. In other words, the first main surface-side outer layer portion 12 includes a plurality of dielectric layers 20 located between the first main surface TS1 and the internal electrode layer 30 located closest to the first main surface TS1 side among the plurality of internal electrode layers 30. The dielectric layers 20 used in the first main surface-side outer layer portion 12 may be the same as the dielectric layers 20 used in the inner layer portion 11.

[0065] The second main surface-side outer layer portion 13 is located on the second main surface TS2 side of the multilayer body 10. The second main surface-side outer layer portion 13 is an assembly of a plurality of dielectric layers 20 located between the second main surface TS2 and the internal electrode layer 30 closest to the second main surface TS2. In other words, the second main surface-side outer layer portion 13 includes a plurality of dielectric layers 20 located between the second main surface TS2 and the internal electrode layer 30 located closest to the second main surface TS2 side among the plurality of internal electrode layers 30. The dielectric layers 20 used in the second main surface-side outer layer portion 13 may be the same as the dielectric layers 20 used in the inner layer portion 11.

[0066] As described above, the multilayer body 10 includes a laminated plurality of dielectric layers 20 and a plurality of internal electrode layers 30 laminated on dielectric layer 20. That is, the multilayer ceramic capacitor 1 includes the multilayer body 10 including the dielectric layers 20 and the internal electrode layers 30 alternately laminated therein.

[0067] The multilayer body 10 includes a counter electrode portion 11E. The counter electrode portion 11E refers to a portion where the first counter electrode portion 31A of the first internal electrode layer 31 and the second counter electrode portion 32A of the second internal electrode layer 32 are opposed to each other. The counter electrode portion 11E defines and functions as a portion of the inner layer portion 11. FIGS. 8A and 8B each show the ranges of the width direction W and the length direction L of the counter electrode portion 11E. The counter electrode portion 11E is also referred to as a capacitor active portion.

[0068] The multilayer body 10 includes an end surface-side outer layer portion. The end surface-side outer layer portion includes a first end surface-side outer layer portion LG1 located on the first end surface LS1 side and a second end surface-side outer layer portion LG2 located on the second end surface LS2 side. The first end surface-side outer layer portion LG1 includes the dielectric layers 20 and the first extension portion 31B located between the counter electrode portion 11E and the first end surface LS1. That is, the first end surface-side outer layer portion LG1 is an assemble of portions on the first end surface LS1 side of the plurality of dielectric layer 20, and the plurality of first extension portion 31B. The second end surface-side outer layer portion LG2 includes the dielectric layers 20 and the second extension portions 32B located between the counter electrode portion 11E and the second end surface LS2. That is, the second end surface-side outer layer portion LG2 is an assembly of portions on the second end surface LS2 side of the plurality of dielectric layer 20, and the plurality of second extension portion 32B. FIGS. 6, 8A, and 8B each show the ranges in the length direction L of the first end surface-side outer layer portion LG1 and the second end surface-side outer layer portion LG2. The first end surface-side outer layer portion LG1 and the second end surface-side outer layer portion LG2 are also referred to as L gaps or end gaps.

[0069] The multilayer body 10 includes a lateral surface-side outer layer portion. The lateral surface-side outer layer portion includes a first lateral surface-side outer layer portion WG1 located on the first lateral surface WS1 side and a second lateral surface-side outer layer portion WG2 located on the second lateral surface WS2 side. The first lateral surface-side outer layer portion WG1 includes the dielectric layers 20 located between the counter electrode portion 11E and the first lateral surface WS1. That is, the first lateral surface-side outer layer portion WG1 is an assembly of portions on the first lateral surface WS1 side of the plurality of dielectric layers 20. The second lateral surface-side outer layer portion WG2 includes the dielectric layers 20 located between the counter electrode portion 11E and the second lateral surface WS2. That is, the second lateral surface-side outer layer portion WG2 is an assembly of portions on the second lateral surface WS2 side of the dielectric layers 20. FIGS. 7, 8A, and 8B each show the ranges in the width direction W of the first lateral surface-side outer layer portion WG1 and the second lateral surface-side outer layer portion WG2. The first lateral surface-side outer layer portion WG1 and the second lateral surface-side outer layer portion WG2 are also referred to as W gaps or side gaps.

[0070] As shown in FIGS. 6 to 8B, in the multilayer body 10, when the dimension in the length direction L from the first end surface LS1 to the second end surface LS2 is defined as l, the dimension in the width direction W from the first lateral surface WS1 to the second lateral surface WS2 is defined as w, and the dimension in the height direction T from the first main surface TS1 to the second main surface TS2 is defined as t, a dimensional relationship w>l>t, for example, is satisfied. With such a configuration, it is possible to increase the width of each of the extension portions at the end surface of the internal electrode layers 30. Further, since it is possible to reduce the distance between the first external electrode 40A and the second external electrode 40B, it is possible to reduce the ESL of the multilayer ceramic capacitor 1.

[0071] The dimension l in the length direction L from the first end surface LS1 to the second end surface LS2 of the multilayer body 10 is preferably about 0.05 mm or more and about 0.7 mm or less, for example. The dimension w in the width direction W from the first lateral surface WS1 to the second lateral surface WS2 of the multilayer body 10 is preferably about 0.15 mm or more and about 1.5 mm or less, for example. Furthermore, it is preferable that the dimension t in the height direction T from the first main surface TS1 to the second main surface TS2 of the multilayer body 10 is about 150 μm or less, for example. Such a configuration enables high-density mounting. Furthermore, the dimension t in the height direction T from the first main surface TS1 to the second main surface TS2 of the multilayer body 10 is preferably about 100 μm or less, and more preferably about 50 μm or less, for example. Such a configuration enables higher density mounting.

[0072] The respective dimensions of l, w, and t of the multilayer body 10 are measured by the following methods.

[0073] First, the dimension w of the multilayer body 10 is measured. More specifically, the dimension w of the multilayer body 10 is measured by a micrometer at the middle position in the length direction L of the multilayer ceramic capacitor 1, i.e., at the L/2 position of the multilayer ceramic capacitor 1.

[0074] Next, the dimensions l and t of the multilayer body 10 are measured. First, the same multilayer ceramic capacitor 1 as the multilayer ceramic capacitor 1 for which the dimension w was measured is polished so as to be parallel to the LT plane up to the middle position in the width direction W of the multilayer ceramic capacitor 1, i.e., up to the W/2 position of the multilayer ceramic capacitor 1. Then, the LT cross section exposed by the polishing is observed by microscope. The dimension l of the multilayer body 10 is measured by microscope at the middle position in the LT cross section in the height direction T of the multilayer body 10, i.e., at the t/2 position of the multilayer body 10. The dimension t of the multilayer body 10 is measured by microscope at the middle position in the LT cross section in the length direction L of the multilayer body 10, i.e., at the l/2 position of the multilayer body 10.

[0075] The external electrode 40 includes a first external electrode 40A provided on the first end surface LS1 side and a second external electrode 40B provided on the second end surface LS2 side.

[0076] The first external electrode 40A is connected to the first internal electrode layers 31. The first external electrode 40A of an example embodiment of the present invention includes a first surface portion 40A1 located on the first end surface LS1, a second surface portion 40A2 located on a portion of the first main surface TS1, a third surface portion 40A3 located on a portion of the second main surface TS2, a fourth surface portion 40A4 located on a portion of the first lateral surface WS1, and a fifth surface portion 40A5 located on a portion of the second lateral surface WS2. The first external electrode 40A preferably includes at least either one the second surface portion 40A2 located on a portion of the first main surface TS1 and the third surface portion 40A3 located on a portion of the second main surface TS2, the first surface portion 40A1 located on a portion of the first end surface LS1, the fourth surface portion 40A4 located on a portion of the first lateral surface WS1, and the fifth surface portion 40A5 located on a portion of the second lateral surface WS2.

[0077] The first surface portion 40A1 covers the entire first end surface LS1 and is connected to the first internal electrode layers 31. Either the second surface portion 40A2 or the third surface portion 40A3 is connected to a land of the mounting board.

[0078] The fourth surface portion 40A4 is a portion connected to the first extension portions 31B exposed at the first lateral surface WS1. As shown in FIGS. 2, 4, and 5, a dimension L4 in the length direction L of the fourth surface portion 40A4 is larger than a dimension L2 in the length direction L of the second surface portion 40A2. The dimension L4 in the length direction L of the fourth surface portion 40A4 is larger than a dimension L3 in the length direction L of the third surface portion 40A3. That is, an end portion of the fourth surface portion 40A4 adjacent to the center in the length direction protrudes more toward the center in the length direction than the end portion 40A2a of the second surface portion 40A2, and protrudes more toward the center in the length direction than the end portion 40A3a of the third surface portion 40A3.

[0079] The fifth surface portion 40A5 is a portion connected to the first extension portions 31B exposed at the second lateral surface WS2. As shown in FIGS. 3 to 5, a dimension L5 of the fifth surface portion 40A5 in the length direction L is larger than a dimension L2 of the second surface portion 40A2 in the length direction L. Further, the dimension L5 in the length direction L of the fifth surface portion 40A5 is larger than a dimension L3 in the length direction L of the third surface portion 40A3. That is, an end portion of the fifth surface portion 40A5 adjacent to the center in the length direction protrudes more toward the center in the length direction than the end portion 40A2a of the second surface portion 40A2, and protrudes more toward the center in the length direction than the end portion 40A3a of the third surface portion 40A3.

[0080] The dimension L4 in the length direction L of the fourth surface portion 40A4 and the dimension L5 in the length direction L of the fifth surface portion 40A5 of the first external electrode 40A are preferably, for example, about 110% or more and about 245% or less of the dimension L2 in the length direction L of the second surface portion 40A2 and the dimension L3 in the length direction L of the third surface portion 40A3, respectively.

[0081] The second external electrode 40B is connected to the second internal electrode layers 32. The second external electrode 40B of an example embodiment of the present invention includes a sixth surface portion 40B1 located on the second end surface LS2, a seventh surface portion 40B2 located on a portion of the first main surface TS1, an eighth surface portion 40B3 located on a portion of the second main surface TS2, a ninth surface portion 40B4 located on a portion of the first lateral surface WS1, and a tenth surface portion 40B5 located on a portion of the second lateral surface WS2. The second external electrode 40B preferably includes at least either one of the seventh surface portion 40B2 located on a portion of the first main surface TS1 and the eighth surface portion 40B3 located on a portion of the second main surface TS2, the sixth surface portion 40B1 located on a portion of the second end surface LS2, the ninth surface portion 40B4 located on a portion of the first lateral surface WS1, and the tenth surface portion 40B5 located on a portion of the second lateral surface WS2.

[0082] The sixth surface portion 40B1 covers the entire second end surface LS2 and is connected to the second internal electrode layers 32. Either the seventh surface portion 40B2 or the eighth surface portion 40B3 is connected to a land of the mounting board.

[0083] The ninth surface portion 40B4 is a portion connected to the second extension portions 32B exposed at the first lateral surface WS1. As illustrated in FIGS. 2, 4, and 5, a dimension L9 in the length direction L of the ninth surface portion 40B4 is larger than a dimension L7 in the length direction L of the seventh surface portion 40B2. The dimension L9 in the length direction L of the ninth surface portion 40B4 is larger than a dimension L8 in the length direction L of the eighth surface portion 40B3. That is, an end portion of the ninth surface portion 40B4 adjacent to the center in the length direction protrudes more toward the center than the end portion 40B2a of the seventh surface portion 40B2, and protrudes more toward the center than the end portion 40B3a of the eighth surface portion 40B3.

[0084] The tenth surface portion 40B5 is a portion connected to the second extension portions 32B exposed at the second lateral surface WS2. As shown in FIGS. 3 to 5, the dimension L10 in the length direction L of the tenth surface portion 40B5 is larger than the dimension L7 in the length direction L of the seventh surface portion 40B2. The dimension L10 in the length direction L of the tenth surface portion 40B5 is larger than the dimension L8 in the length direction L of the eighth surface portion 40B3. That is, an end portion of the tenth surface portion 40B5 adjacent to the center in the length direction protrudes more toward the center in the length direction than the end portion 40B2a of the seventh surface portion 40B2, and protrudes more toward the center in the length direction than the end portion 40B3a of the eighth surface portion 40B3.

[0085] The dimension L9 in the length direction L of the ninth surface portion 40B4 and the dimension L10 in the length direction L of the tenth surface portion 40B5 of the second external electrode 40B are preferably, for example, about 110% or more and about 245% or less of the dimension L7 in the length direction L of the seventh surface portion 40B2 and the dimension L8 in the length direction L of the eighth surface portion 40B3, respectively.

[0086] The dimension in the length direction L of the second surface portion 40A2 and the third surface portion 40A3 of the first external electrode 40A and the seventh surface portion 40B2 and the eighth surface portion 40B3 of the second external electrode 40B, which are surface portions on the main surface, and the dimension in the length direction L of the fourth surface portion 40A4 and the fifth surface portion 40A5 of the first external electrode 40A and the ninth surface portion 40B4 and the tenth surface portion 40B5 of the second external electrode 40B, which are surface portions on the lateral surface, are measured by the following method.

[0087] The dimensions in the length direction L of the second surface portion 40A2 and the seventh surface portion 40B2 are measured by a microscope at a position which is one half in the width direction W when observed from the first main surface TS1 of the multilayer body 10. Similarly, the dimensions in the length direction L of the third surface portion 40A3 and the eighth surface portion 40B3 are measured by a microscope at a position which is one half in the width direction W when observed from the second main surface TS2 of the multilayer body 10.

[0088] The dimensions of the fourth surface portion 40A4 and the ninth surface portion 40B4 in the length direction L are measured by a microscope at a position which is one half in the height direction T when observed from the first lateral surface WS1 of the multilayer body 10. Similarly, the dimensions in the length direction L of the fifth surface portion 40A5 and the tenth surface portion 40B5 are measured by a microscope at a position which is one half in the height direction T when observed from the second lateral surface WS2 of the multilayer body 10.

[0089] The ratio of the dimension in the length direction L of the surface portion on the lateral surface to the dimension in the length direction L of the surface portion on the main surface is calculated based on the dimension in the length direction L of the surface portion on the main surface and the dimension in the length direction L of the surface portion on the lateral surface measured in this manner.

[0090] As shown in FIG. 10A, the first external electrode 40A includes a first base electrode layer 50A and a first plated layer 60A provided on the first base electrode layer 50A. The first base electrode layer 50A is provided on the surface of the multilayer body 10. The first plated layer 60A covers the first base electrode layer 50A.

[0091] As shown in FIG. 10B, the second external electrode 40B has a second base electrode layer 50B and a second plated layer 60B disposed on second base electrode layer 50B. The second base electrode layer 50B is provided on the surface of the multilayer body 10. The second plated layer 60B covers the second base electrode layer 50B.

[0092] The first base electrode layer 50A and the second base electrode layer 50B include at least one selected from a fired layer and a thin film layer, for example.

[0093] The first base electrode layer 50A and the second base electrode layer 50B are thin film layers in an example embodiment of the present invention. The thin film layer is a layer on which metal particles are deposited.

[0094] In a case in which the first base electrode layer 50A and the second base electrode layer 50B are formed as thin film layers, they are preferably formed by a thin film forming method such as a sputtering method or a deposition method. Here, an electrode formed by using a sputtering method (sputtered electrode) will be described.

[0095] The first base electrode layer 50A according to an example embodiment of the present invention includes a first thin film layer 51A formed by a sputtered electrode. Second base electrode layer 50B includes a second thin film layer 51B formed by a sputtered electrode. When the base electrode layer includes a sputtered electrode, it is preferable to form the sputtered electrode directly on the first main surface TS1 and the second main surface TS2 of the multilayer body 10.

[0096] As shown in FIGS. 6 and 10A, the first thin film layer 51A formed by the sputtered electrode is provided on a portion of the first main surface TS1 on the first end surface LS1 side and on a portion of the second main surface TS2 on the first end surface LS1 side. More specifically, it is preferable that the first thin film layer 51A is provided at a portion covered by the first external electrode 40A shown in FIG. 4 on the first main surface TS1. It is preferable that the first thin film layer 51A is provided at a portion covered by the first external electrode 40A shown in FIG. 5 on the second main surface TS2.

[0097] Furthermore, as shown in FIG. 9, it is preferable that the first thin film layer 51A is provided on a portion of the first main surface TS1 and is also provided on a portion of the first lateral surface WS1 in a manner somewhat surrounding the portion of the first lateral surface WS1 continuously from the portion of the first main surface TS1. It is preferable that the first thin film layer 51A is provided on a portion of the second main surface TS2 and is also provided on a portion of the first lateral surface WS1 in a manner somewhat surrounding the portion of the first lateral surface WS1 continuously from the portion of the second main surface TS2.

[0098] Further, although not shown, it is preferable that, similarly to the first lateral surface WS1 side, also on the second lateral surface WS2 side, the first thin film layer 51A is provided on a portion of the first main surface TS1 and is also provided on a portion of the second lateral surface WS2 in a manner somewhat surrounding the portion of the second lateral surface WS2 continuously from the portion of the first main surface TS1. Furthermore, it is preferable that the first thin film layer 51A is provided on a portion of the second main surface TS2 and is also provided on a portion of the second lateral surface WS2 in a manner somewhat surrounding the portion of the second lateral surface WS2 continuously from the portion of the second main surface TS2.

[0099] For example, in a case in which a chamfered portion such as a rounded portion is provided at the ridge of the multilayer body 10, it is preferable that the first thin film layer 51A is provided on a portion of the first main surface TS1 on the first end surface LS1 side, and is also provided on a chamfered portion on the first lateral surface WS1 side and a chamfered portion on the second lateral surface WS2 side continuously from the portion of the first main surface TS1 on the first end surface LS1 side. It is preferable that the first thin film layer 51A is provided on a portion of the second main surface TS2 on the first end surface LS1 side, and is also provided on a chamfered portion on the first lateral surface WS1 side and a chamfered portion on the second lateral surface WS2 side continuously from the portion of the second main surface TS2 on the first end surface LS1 side. With such a configuration, it is possible to easily form thin film layers by a sputtering method or other methods.

[0100] An end portion of the first extension portion 31B adjacent to the center in the length direction protrudes more toward the center in the length direction than the end portion adjacent to the center in the length direction of the first thin film layer 51A provided on the first main surface TS1 and the end portion adjacent to the center in the length direction of the first thin film layer 51A provided on the second main surface TS2. Similarly, an end portion of the second extension portion 32B adjacent to the center in the length direction protrudes more toward the center in the length direction than the end portion adjacent to the center in the length direction of the second thin film layer 51B provided on the first main surface TS1 and the end portion adjacent to the center in the length direction of the second thin film layer 51B provided on the second main surface TS2.

[0101] According to the above-described method, when forming a plated layer, it is possible to control the distances between the first thin film layer 51A provided on a portion of the first lateral surface WS1 and a portion of the second lateral surface WS2, and the internal electrode layers 30 exposed on the first lateral surface WS1 and the second lateral surface WS2. Thus, it becomes easy to deposit a plated layer also on the surface of the multilayer body 10 between the first thin film layer 51A provided on a portion of the first lateral surface WS1 and a portion of the second lateral surface WS2, and the internal electrode layers 30 exposed on the first lateral surface WS1 and the second lateral surface WS2.

[0102] As shown in FIGS. 6 and 10B, the second thin film layer 51B formed by the sputtered electrode is provided on a portion of the first main surface TS1 on the second end surface LS2 side and on a portion of the second main surface TS2 on the second end surface LS2 side. More specifically, it is preferable that the second thin film layer 51B is provided on a portion of the first main surface TS1 which is covered by the second external electrode 40B shown in FIG. 4. It is preferable that the second thin film layer 51B is provided on a portion of the second main surface TS2 which is covered by the second external electrode 40B shown in FIG. 5.

[0103] Furthermore, as shown in FIG. 9, it is preferable that the second thin film layer 51B is provided on a portion of the first main surface TS1 and is also provided on a portion of the first lateral surface WS1 in a manner somewhat surrounding the portion of the first lateral surface WS1 continuously from the portion of the first main surface TS1. It is preferable that the second thin film layer 51B is provided on a portion of the second main surface TS2 and is also provided on a portion of the first lateral surface WS1 in a manner somewhat surrounding the portion of the first lateral surface WS1 continuously from the portion of the second main surface TS2.

[0104] Further, although not shown, it is preferable that, similarly to the first lateral surface WS1 side, also on the second lateral surface WS2 side, the second thin film layer 51B is provided on a portion of the first main surface TS1 and is also provided on a portion of the second lateral surface WS2 in a manner somewhat surrounding the portion of the second lateral surface WS2 continuously from the portion of the first main surface TS1. Furthermore, it is preferable that the second thin film layer 51B is provided on a portion of the second main surface TS2 and is also provided on a portion of the second lateral surface WS2 in a manner somewhat surrounding the portion of the second lateral surface WS2 continuously from the portion of the second main surface TS2.

[0105] For example, in a case in which a chamfered portion such as a rounded portion is provided at the ridge of the multilayer body 10, it is preferable that the second thin film layer 51B is provided on a portion of the first main surface TS1 on the second end surface LS2 side, and is also provided on a chamfered portion on the first lateral surface WS1 side and a chamfered portion on the second lateral surface WS2 side continuously from the portion of the first main surface TS1 on the second end surface LS2 side. It is preferable that the second thin film layer 51B is provided on a portion of the second main surface TS2 on the second end surface LS2 side, and is also provided on a chamfered portion on the first lateral surface WS1 side and a chamfered portion on the second lateral surface WS2 side continuously from the portion of the second main surface TS2 on the second end surface LS2 side. With such a configuration, it is possible to easily form thin film layers by a sputtering method or other methods.

[0106] According to the above-described method, when forming a plated layer, it is possible to control the distances between the second thin film layer 51B provided on a portion of the first lateral surface WS1 and a portion of the second lateral surface WS2, and the internal electrode layers 30 exposed on the first lateral surface WS1 and the second lateral surface WS2. Thus, it becomes easy to deposit a plated layer also on the surface of the multilayer body 10 between the second thin film layer 51B provided on a portion of the first lateral surface WS1 and a portion of the second lateral surface WS2, and the internal electrode layers 30 exposed on the first lateral surface WS1 and the second lateral surface WS2.

[0107] The thin film layer formed by the sputtered electrode preferably includes at least one metal selected from the group including, for example, Mg, Al, Ti, W, Cr, Cu, Ni, Ag, Co, Mo or V. Thus, it is possible to increase the adhesion of the external electrode 40 to the multilayer body 10. The thin film layer may be a single layer or may include a plurality of layers. For example, the thin film layer may include a two-layer structure including a layer of Ni—Cr alloy and a layer of Ni—Cu alloy.

[0108] The thickness of the sputtered electrode in the lamination direction connecting the first main surface TS1 and the second main surface TS2 is preferably about 50 nm or more and about 400 nm or less, and more preferably about 50 nm or more and about 130 nm or less, for example.

[0109] When providing the base electrode layer by directly forming an electrode using the sputtering method on the first main surface TS1 and the second main surface TS2 of the multilayer body 10, it is preferable to provide a base electrode layer as a fired layer on the first end surface LS1 and the second end surface LS2, or alternatively it is preferable to directly provide a plated layer to be described later without providing the base electrode layer. In an example embodiment of the present invention, a plated layer to be described later is directly provided on the first end surface LS1 and the second end surface LS2 without providing a base electrode layer.

[0110] As will be described later in the modified example, the first base electrode layer 50A and the second base electrode layer 50B may be fired layers. It is preferable that the fired layer includes a metal component, and either a glass component or a ceramic component, or a metal component and both a glass component and a ceramic component. The metal component includes at least one selected from Cu, Ni, Ag, Pd, Ag—Pd alloys, or Au, for example. The glass component includes at least one selected from B, Si, Ba, Mg, Al, or Li, for example. For the ceramic component, a ceramic material of the same kind as that of the dielectric layer 20 may be used, or a ceramic material of a different kind may be used. The ceramic component includes, for example, at least one selected from BaTiO₃, CaTiO₃, (Ba, Ca) TiO₃, SrTiO₃, or CaZrO₃, for example.

[0111] The fired layer is obtained, for example, by applying an electrically conductive paste containing glass and metal to the multilayer body 10 and firing the paste. The fired layer may be obtained, for example, by co-firing a laminate chip including internal electrode layers and dielectric layers, and an electrically conductive paste applied to the laminate chip, or may be obtained, for example, by firing the laminate chip including the internal electrode layers and the dielectric layers to obtain the multilayer body 10, and thereafter applying the electrically conductive paste to the multilayer body 10 for firing. In a case of co-firing the laminate chip including the internal electrode layers and the dielectric layers, and the electrically conductive paste applied to the laminate chip, it is preferable that the fired layer is formed by firing a material to which a ceramic material instead of glass component is added. In this case, it is particularly preferable to use, as the ceramic material to be added, the same type of ceramic material as the dielectric layer 20. Furthermore, the fired layer may include a plurality of layers.

[0112] Alternatively, the first plated layer 60A and the second plated layer 60B described later may be directly provided on the multilayer body 10 without the first base electrode layer 50A and the second base electrode layer 50B provided.

[0113] The first plated layer 60A covers the first base electrode layer 50A.

[0114] The second plated layer 60B covers the second base electrode layer SOB.

[0115] The first plated layer 60A and the second plated layer 60B may include, for example, at least one selected from Cu, Ni, Sn, Ag, Pd, an Ag—Pd alloy, Au, and the like. Each of the first plated layer 60A and the second plated layer 60B may include a plurality of layers.

[0116] In a case in which the base electrode layer includes a thin film layer, it is preferable that the plated layer includes a three-layer structure including a Cu plated layer functioning as a lower plated layer, a Ni plated layer functioning as an intermediate plated layer, and a Sn plated layer functioning as an upper plated layer. That is, the first plated layer 60A includes a first Cu plated layer 61A, a first Ni plated layer 62A, and a first Sn plated layer 63A. The second plated layer 60B includes a second Cu plated layer 61B, a second Ni plated layer 62B, and a second Sn plated layer 63B. However, the first plated layer 60A and the second plated layer 60B are not limited to a three-layer structure, and may have other layer configurations.

[0117] The first Cu plated layer 61A covers the first end surface LS1 of the multilayer body 10, and the first thin film layer 51A functioning as the first base electrode layer 50A provided on the first main surface TS1 and the second main surface TS2 of the multilayer body 10. In an example embodiment of the present invention, the first Cu plated layer 61A covers portions of the first lateral surface WS1 and the second lateral surface WS2 of the multilayer body 10 at which the internal electrode layers 30 are exposed. At this time, the gap between the first thin film layer 51A and the internal electrode layer 30 exposed on the surface of the multilayer body 10, and the gaps between the plurality of internal electrode layers 30 exposed on the surface of multilayer body 10 are made narrow. Therefore, a plated layer is also deposited on the regions of these gaps.

[0118] The first Ni plated layer 62A covers the first Cu plated layer 61A. The first Sn plated layer 63A covers the first Ni plated layer 62A. In an example embodiment of the present invention, the first plated layer 60A is electrically connected directly to the first internal electrode layer 31.

[0119] The second Cu plated layer 61B covers the second end surface LS2 of the multilayer body 10, and the second thin film layer 51B functioning as the second base electrode layer 50B provided on the first main surface TS1 and the second main surface TS2 of the multilayer body 10. In an example embodiment of the present invention, the second Cu plated layer 61B covers portions of the first lateral surface WS1 and the second lateral surface WS2 of the multilayer body 10 at which the internal electrode layers 30 are exposed. At this time, the gap between the second thin film layer 51B and the internal electrode layer 30 exposed on the surface of multilayer body 10, and the gaps between the plurality of internal electrode layers 30 exposed on the surface of multilayer body 10 are made narrow. Therefore, a plated layer is also deposited on the regions of these gaps.

[0120] The second Ni plated layer 62B covers the second Cu plated layer 61B. The second Sn plated layer 63B covers the second Ni plated layer 62B layer. In an example embodiment of the present invention, the second plated layer 60B is electrically connected directly to the second internal electrode layer 32.

[0121] By providing a plated layer including a Cu plated layer and a Ni plated layer so as to cover the base electrode layer, the base electrode layer is prevented from being eroded by solder at the time of mounting the multilayer ceramic capacitor 1. Furthermore, by providing the Sn plated layer on the surface of the Ni plated layer, the wettability of the solder when mounting the multilayer ceramic capacitor 1 is improved. With such a configuration, it is possible to easily mount the multilayer ceramic capacitor 1.

[0122] The thickness per plated layer is preferably about 2 μm or more and about 15 μm or less, for example. That is, the average thickness of each of the first Cu plated layer 61A, the first Ni plated layer 62A, the first Sn plated layer 63A, the second Cu plated layer 61B, the second Ni plated layer 62B, and the second Sn plated layer 63B is preferably about 2 μm or more and about 15 μm or less, for example. More specifically, the average thickness of each of the first Cu plated layer 61A and the second Cu plated layer 61B is more preferably about 5 μm or more and about 8 μm or less, for example. Furthermore, the average thickness of each of the first Ni plated layer 62A, the first Sn plated layer 63A, the second Ni plated layer 62B, and the second Sn plated layer 63B is more preferably about 2 μm or more and about 4 μm or less, for example.

[0123] When the dimension in the length direction between the first end surface LS1 and the second end surface LS2 of the multilayer ceramic capacitor 1 including the multilayer body 10 and the external electrodes 40 is defined as dimension L, the dimension L is preferably about 0.1 mm or more and about 0.8 mm or less, for example. When the dimension in the width direction between the first lateral surface WS1 and the second lateral surface WS2 of the multilayer ceramic capacitor 1 is defined as dimension W, the dimension W is preferably about 0.2 mm or more and about 1.6 mm or less, for example. When the dimension in the height direction between the first main surface TS1 and the second main surface TS2 of the multilayer ceramic capacitor 1 is defined as dimension T, the dimension T is preferably about 0.05 mm or more and about 0.2 mm or less, for example. The dimension L in the length direction of the multilayer ceramic capacitor 1 of an example embodiment of the present invention is smaller than the dimension W in the width direction of the multilayer ceramic capacitor 1. In an example embodiment of the present invention, the height direction between the first main surface TS1 and the second main surface TS2 of the multilayer ceramic capacitor 1 corresponds to the lamination (stacking) direction of the dielectric layers 20 and the internal electrode layers 30.

[0124] As described above, the multilayer ceramic capacitor 1 of the present example embodiment has a dimensional relationship of w>l>t, where l is defined as the dimension in the length direction L between the first end surface LS1 and the second end surface LS2 of the multilayer body 10, w is defined as the dimension in the width direction W between the first lateral surface WS1 and the second lateral surface WS2, and t is defined as the dimension in the height direction T between the first main surface TS1 and the second main surface TS2. With such a configuration, it is possible to increase the width of each of the extension portions at the end surface of the internal electrode layers 30. Further, since it is possible to reduce the distance between the first external electrode 40A and the second external electrode 40B, it is possible to reduce the ESL of the multilayer ceramic capacitor 1.

[0125] In addition, in the multilayer ceramic capacitor 1 of the present example embodiment, the dimension L4 in the length direction L of the fourth surface portion 40A4 and the dimension L5 in the length direction L of the fifth surface portion 40A5 of the first external electrode 40A are larger than the dimension L2 in the length direction L of the second surface portion 40A2 and the dimension L3 in the length direction L of the third surface portion 40A3, respectively, and the dimension L9 in the length direction L of the ninth surface portion 40B4 and the dimension L10 in the length direction L of the tenth surface portion 40B5 of the second external electrode 40B are larger than the dimension L7 in the length direction L of the seventh surface portion 40B2 and the dimension L8 in the length direction L of the eighth surface portion 40B3. With such a configuration, when the multilayer ceramic capacitor 1 is mounted on the substrate by soldering the first external electrode 40A and the second external electrode 40B to the land, it is possible to sufficiently spread the solder on the fourth surface portion 40A4 and the fifth surface portion 40A5 of the first external electrode 40A and the ninth surface portion 40B4 and the tenth surface portion 40B5 of the second external electrode 40B, which tend to allow the solder to spread less. Therefore, in each of the fourth surface portion 40A4 and the fifth surface portion 40A5 of the first external electrode 40A and the ninth surface portion 40B4 and the tenth surface portion 40B5 of the second external electrode 40B, it is possible to reduce or prevent a change in the amount of solder and a difference in tensile stress caused by the solder. Therefore, it is possible to reduce or prevent deterioration of a self-alignment effect and perform stable mounting. As a result, it is possible to reduce or prevent short circuit failure caused by tilting or rotating of the multilayer ceramic capacitor 1. In addition, the self-alignment effect refers to an effect whereby, when soldering, a force that reduces the surface area of a molten solder, i.e., the surface tension, is applied to the molten solder, such that the electronic element as a mounting target supported by the molten solder is moved, the positioning is performed. By obtaining this self-alignment effect, it is possible to reduce or prevent positional deviation at the time of mounting.

[0126] As described above, the dimension L4 in the length direction L of the fourth surface portion 40A4 and the dimension L5 in the length direction L of the fifth surface portion 40A5 of the first external electrode 40A are preferably, for example, about 110% or more and about 245% or less of the dimension L2 in the length direction L of the second surface portion 40A2 and the dimension L3 in the length direction L of the third surface portion 40A3. Further, the dimension L9 in the length direction L of the ninth surface portion 40B4 of the second external electrode 40B and the dimension L10 in the length direction L of the tenth surface portion 40B5 are preferably, for example, about 110% or more and about 245% or less of the dimension L7 in the length direction L of the seventh surface portion 40B2 and the dimension L8 in the length direction L of the eighth surface portion 40B3. When the ratio is smaller than about 110%, it is difficult to reduce or prevent the change in the amount of solder in each of the fourth surface portion 40A4 and the fifth surface portion 40A5 of the first external electrode 40A, and the ninth surface portion 40B4 and the tenth surface portion 40B5 of the second external electrode 40B. This may make it difficult to reduce or prevent the difference in tensile stress caused by the solder, and the multilayer ceramic capacitor 1 may rotate when mounted. On the other hand, when the ratio is greater than about 245%, depending on the amount of solder, the first external electrode 40A and the second external electrode 40B may electrically connect to each other to cause a short circuit. Therefore, the ratio is preferably about 110% or more and about 245% or less, for example.

[0127] Hereinafter, a description will be given of a modified example of the layer configuration of the external electrode 40 of the multilayer ceramic capacitor 1 of an example embodiment of the present invention. In the following description, the same components as those of the above example embodiment are denoted by the same reference numerals, and a detailed description thereof is omitted. FIGS. 11A and 11B are each a cross-sectional view showing a modified example of a layer configuration of the external electrode 40 of the multilayer ceramic capacitor 1 of an example embodiment of the present invention, and are views corresponding to FIGS. 10A and 10B, respectively.

[0128] In the present modified example, the configuration of the external electrode 40 differs from that of the above example embodiment.

[0129] The first external electrode 40A includes the first base electrode layer 50A and the first plated layer 60A. The first base electrode layer 50A of the present modified example includes a first fired layer 52A. The first plated layer 60A of the present modified example includes the first Ni plated layer 62A and the first Sn plated layer 63A.

[0130] The second external electrode 40B has the second base electrode layer 50B and the second plated layer 60B. The second base electrode layer 50B of the present modified example includes a second fired layer 52B. The second plated layer 60B of this modified example includes the second Ni plated layer 62B and the second Sn plated layer 63B.

[0131] In the present modified example, for example, similarly to the first external electrode 40A described above, the first base electrode layer 50A includes the first surface portion located on the first end surface LS1, the second surface portion located on a portion of the first main surface TS1, the third surface portion located on a portion of the second main surface TS2, the fourth surface portion located on a portion of the first lateral surface WS1, and the fifth surface portion located on a portion of the second lateral surface WS2. In this modified example, the first base electrode layer 50A is connected to the first internal electrode layers 31.

[0132] The first Ni plated layer 62A covers the first base electrode layer 50A. The first Sn plated layer 63A covers the first Ni plated layer 62A.

[0133] In the present modified example, for example, similarly to the second external electrode 40B described above, the second base electrode layer 50B includes a sixth surface portion located on the second end surface LS2, the seventh surface portion located on a portion of the first main surface TS1, the eighth surface portion located on a portion of the second main surface TS2, the ninth surface portion located on a portion of the first lateral surface WS1, and the tenth surface portion located on a portion of the second lateral surface WS2. In this modified example, the second base electrode layer SOB is connected to the second internal electrode layers 32.

[0134] The second Ni plated layer 62B covers the second base electrode layer 50B. The second Sn plated layer 63B covers the second Ni plated layer 62B.

[0135] The first fired layer 52A of the first base electrode layer 50A and the second fired layer 52B of the second base electrode layer 50B may be obtained by, for example, applying an electrically conductive paste containing glass and metal to a multilayer body, and firing the electrically conductive paste. In a case of co-firing a laminate chip prior to firing and the electrically conductive paste applied to the laminate chip, it is preferable that the fired layer is formed by firing a material to which a ceramic material instead of glass component was added. At this time, it is particularly preferable to use, as the ceramic material to be added, the same type of ceramic material as the dielectric layer 20.

[0136] In a case in which the base electrode layer is made of a fired layer, the first plated layer 60A and the second plated layer 60B preferably include a two layer structure in which a Sn plated layer is provided on Ni plated layer. In such a case, the Ni plated layer prevents the base electrode layer from being eroded by the solder when mounting the multilayer ceramic capacitor 1. Furthermore, the Sn plated layer also improves the wettability of the solder when mounting the multilayer ceramic capacitor 1. With such a configuration, it is possible to easily mount the multilayer ceramic capacitor 1.

[0137] The first plated layer 60A and the second plated layer 60B are not limited to the two-layer structure, and may be provided in a three-layer structure including a Cu-plating or may include another layer structure as in the above example embodiment.

[0138] The thickness per plated layer is preferably about 2 μm or more and about 15 μm or less, for example. That is, the average thickness of each of the first Ni plated layer 62A, the first Sn plated layer 63A, the second Ni plated layer 62B, and the second Sn plated layer 63B is preferably about 2 μm or more and about 15 μm or less, for example. More specifically, it is more preferable that the average thickness of each of the first Ni plated layer 62A, the first Sn plated layer 63A, the second Ni plated layer 62B, and the second Sn plated layer 63B is about 2 μm or more and about 4 μm or less, for example.

[0139] Next, a non-limiting example of a method of manufacturing the multilayer ceramic capacitor 1 of an example embodiment of the present invention will be described.

[0140] A dielectric sheet for the dielectric layer 20 and an electrically conductive paste for the internal electrode layer 30 are provided. The electrically conductive paste for the dielectric sheet and the internal electrode includes a binder and a solvent. A known binder and solvent may be used. A paste made of an electrically conductive material is, for example, one made by an organic binder and an organic solvent being added to a metal powder.

[0141] An electrically conductive paste for the internal electrode layer 30 is printed on the dielectric sheet using a printing plate that is patterned to form the shape of the internal electrode layer 30 of an example embodiment of the present invention by, for example, screen printing, gravure printing, or the like. Thus, the dielectric sheet on which the pattern of the first internal electrode layer 31 is provided, and the dielectric sheet on which the pattern of the second internal electrode layer 32 is provided are prepared.

[0142] A predetermined number of dielectric sheets on which the pattern of the internal electrode layer is not printed are laminated such that a portion is formed which functions as the first main surface-side outer layer portion 12 on the first main surface TS1 side. On top of that, the dielectric sheet on which the pattern of the first internal electrode layer 31 is printed and the dielectric sheet on which the pattern of the second internal electrode layer 32 is printed are sequentially laminated alternately, such that a portion is formed which functions as the inner layer portion 11. On this portion functioning as the inner layer portion 11, a predetermined number of dielectric sheets in which the pattern of the internal electrode layer is not printed are laminated, such that a portion is formed which functions as the second main surface-side outer layer portion 13 on the second main surface TS2 side. Thus, a multilayer sheet is produced.

[0143] The multilayer sheet is pressed in the lamination direction via hydrostatic pressing, for example, such that a multilayer block is produced.

[0144] The multilayer block is cut to a predetermined size, such that laminate chips are cut out. At this time, corners and ridges of the laminate chips may be rounded by barrel polishing or the like.

[0145] The laminate chip is fired to produce the multilayer body 10. The firing temperature depends on the materials of the dielectric layers 20 and the internal electrode layers 30. However, it is preferably about 900° C. or more and about 1400° C. or less, for example.

[0146] In an example embodiment of the present invention, the base electrode layer includes a thin film layer. When forming the base electrode layer by a thin film layer, a thin film layer is formed at a portion where the external electrode of the multilayer body 10 is to be formed, by performing masking or other processing. The thin film layer is formed by a thin film forming method such as a sputtering method or a deposition method. In an example embodiment of the present invention, a sputtered electrode as a thin film layer is formed by the sputtering method.

[0147] FIGS. 12 to 14 are each a view of an intermediate state in the manufacturing processing of the multilayer ceramic capacitor of an example embodiment of the present invention, and a view showing a state after the thin film layer is provided on the multilayer body 10 and before the plated layer is provided. FIG. 12 is a view of a condition in which the first thin film layer 51A and the second thin film layer 51B as a thin film layer are provided on the multilayer body 10, and corresponds to the LT cross section of FIG. 6. FIG. 13 is a view of a condition in which the first thin film layer 51A functioning as a thin film is provided on the multilayer body 10, and corresponds to the WT cross section of FIG. 7. FIG. 14 is a view of a condition in which the first thin film layer 51A and the second thin film layer 51B are provided on the multilayer body 10, and corresponds to FIG. 9 and shows a surface of the first lateral surface WS1 of the multilayer body 10.

[0148] The first thin film layer 51A including a sputtered electrode is provided on a portion of the first main surface TS1 on the first end surface LS1 side and a portion of the second main surface TS2 on first end surface LS1 side. The second thin film layer 51B including a sputtered electrode is provided on a portion of the first main surface TS1 on the second end surface LS2 side and a portion of the second main surface TS2 on the second end surface LS2 side.

[0149] In an example embodiment of the present invention, the thin film layer including a sputtered electrode is provided on a portion of the first main surface TS1 and on a portion of the second main surface TS2, and is also provided on a portion of the first lateral surface WS1 and on a portion of the second lateral surface WS2 in a manner somewhat surrounding the portion of the first lateral surface WS1 and the portion of the second lateral surface WS2 continuously from the portion of the first main surface TS1 and the portion of the second main surface TS2. With such a configuration, it is possible to control the distance between the thin film layer provided on a portion of the first lateral surface WS1 and on a portion of the second lateral surface WS2, and the internal electrode layers exposed on the first lateral surface WS1 and the second lateral surface WS2. Thus, it is possible to deposit a plated layer even on the surface of the multilayer body 10 between the thin film layer provided on the portion of the first lateral surface WS1 and the portion of the second lateral surface WS2, and the internal electrode layers exposed on the first lateral surface WS1 and the second lateral surface WS2.

[0150] Thereafter, a plated layer is formed on the surfaces of the base electrode layer made of the thin film layer and the multilayer body. In an example embodiment of the present invention, as the plated layer, three plated layers including a Cu plated layer, a Ni plated layer, and a Sn plated layer are provided.

[0151] The plated layer is formed by, for example, an electrolytic plating method. Barrel plating is preferably used as the plating method.

[0152] Here, in a case of providing the thin film layer to surround a portion of the first lateral surface WS1 and a portion of the second lateral surface WS2, it is possible to control the distance between the thin film layer and the internal electrode layers exposed on the first lateral surface WS1 and on the second lateral surface WS2 of the multilayer body 10. Thus, it is possible to deposit a plated layer even on the surface of the multilayer body 10 between the thin film layer provided on the portion of the first lateral surface WS1 and the portion of the second lateral surface WS2, and the internal electrode layers exposed on the first lateral surface WS1 and the second lateral surface WS2.

[0153] Furthermore, the plated layer covers portions of the first lateral surface WS1 and the second lateral surface WS2 of the multilayer body 10 at which the internal electrode layers 30 are exposed. At this time, the gap between the thin film layer and the internal electrode layer exposed on the surface of multilayer body 10, and the gaps between the plurality of internal electrode layers 30 exposed on the surface of multilayer body 10 are made narrow. Therefore, a plated layer is also deposited on the regions of these gaps.

[0154] When the base electrode layer is formed by a fired layer, on the first end surface LS1 side of the multilayer body 10, an electrically conductive paste functioning as the first base electrode layer is applied to the first surface portion located on the first end surface LS1, the second surface portion located on a portion of first main surface TS1, the third surface portion located on a portion of second main surface TS2, the fourth surface portion located on a portion of the first lateral surface WS1, and the fifth surface portion located on a portion of the second lateral surface WS2 of the multilayer body 10. Furthermore, on the second end surface LS2 side of the multilayer body 10, an electrically conductive paste functioning as the second base electrode layer is applied to the sixth surface portion located on the second end surface LS2, the seventh surface portion located on a portion of the first main surface TS1, the eighth surface portion located on a portion of the second main surface TS2, the ninth surface portion located on a portion of the first lateral surface WS1, and the tenth surface portion located on a portion of the second lateral surface WS2 of the multilayer body 10.

[0155] In a case of co-firing a laminate chip prior to firing and the electrically conductive paste applied to the laminate chip, it is preferable that the fired layer is formed by firing a material to which a ceramic material instead of glass component is added. At this time, it is particularly preferable to use, as the ceramic material to be added, the same type of ceramic material as the dielectric layer 20. In this case, the multilayer body 10 including a fired layer therein is obtained by applying the electrically conductive paste to the laminate chip prior to firing, and co-firing the laminate chip and the electrically conductive paste applied to the laminate chip.

[0156] Thereafter, a plated layer is formed on the surface of the base electrode layer including the fired layer and the multilayer body 10. When the base electrode layer includes a fired layer, for example, a two-layer plated layer including a Ni plated layer and a Sn plated layer is formed. The plated layer is formed by, for example, an electrolytic plating method. Barrel plating is preferably used for the plating method.

[0157] The multilayer ceramic capacitor 1 is manufactured according to such a non-limiting example of a manufacturing process.

[0158] In addition, the configuration of the external electrode is not limited to the above-described configurations. Hereinafter, descriptions are given of modified examples in relation to the positional arrangement of the external electrode 40 of the multilayer ceramic capacitor 1 of an example embodiment of the present invention. In the following description, the same components as those of the above example embodiments are denoted by the same reference numerals, and a detailed description thereof is omitted. FIG. 15 is a cross-sectional view showing a modified example of the positional arrangement of the external electrode 40 of the multilayer ceramic capacitor 1 of an example embodiment of the present invention, and is a view corresponding to FIG. 1.

[0159] In the present modified example, the positional arrangement of the external electrode 40 differs from that of the above example embodiment. In the present modified example, the first external electrode 40A and the second external electrode 40B are provided on only one selected from the first main surface TS1 and the second main surface TS2.

[0160] For example, the first external electrode 40A of the present modified example includes the first surface portion 40A1 located on the first end surface LS1, the third surface portion 40A3 located on a portion of the second main surface TS2, the fourth surface portion 40A4 located on a portion of the first lateral surface WS1, and the fifth surface portion 40A5 located on a portion of the second lateral surface WS2. That is, the first external electrode 40A of the present modified example is not provided on the first main surface TS1.

[0161] For example, the second external electrode 40B of the present modified example includes the sixth surface portion 40B1 located on the second end surface LS2, the eighth surface portion 40B3 located on a portion of the second main surface TS2, the ninth surface portion 40B4 located on a portion of the first lateral surface WS1, and the tenth surface portion 40B5 located on a portion of the second lateral surface WS2. That is, the second external electrode 40B of the present modified example is not provided on the first main surface TS1.

[0162] Even with such a configuration, it is possible to reduce or prevent deterioration of the self-alignment effect, and it is possible to perform stable mounting. Furthermore, by not providing the first external electrode 40A and the second external electrode 40B on the main surface of either the first main surface TS1 or the second main surface TS2, it is possible to reduce the dimension of the multilayer ceramic capacitor 1 in the height direction T, and it is possible to achieve a reduced height of the multilayer ceramic capacitor 1. In addition, by not providing the first external electrode 40A and the second external electrode 40B on the main surface of either the first main surface TS1 or the second main surface TS2, it is possible to further secure the height of the multilayer body 10 by the thickness of the external electrode 40. Therefore, it is possible to increase the volume of the active layer portion of the multilayer body 10, and thus it is possible to achieve higher capacitance of the multilayer ceramic capacitor 1.

[0163] According to an multilayer ceramic capacitor 1 of an example embodiment of the present invention, the following advantageous effects are obtained.

[0164] (1) The multilayer ceramic capacitor 1 according to the present example embodiment includes the multilayer body 10 including the plurality of dielectric layers 20 and the plurality of internal electrode layers 30 laminated on the plurality of dielectric layers 20. The multilayer body 10 further includes the first main surface TS1 and the second main surface TS2 which oppose each other in the height direction, the first end surface LS1 and the second end surface LS2 which oppose each other in the length direction perpendicular or substantially perpendicular to the height direction, and the first lateral surface WS1 and the second lateral surface WS2 which oppose each other in the width direction perpendicular or substantially perpendicular to the height direction and the length direction. The multilayer ceramic capacitor 1 further includes the first external electrode 40A including the first surface portion 40A1 located on the first end surface LS1, at least one selected from the second surface portion 40A2 located on a portion of the first main surface TS1 and the third surface portion 40A3 located on a portion of the second main surface TS2, the fourth surface portion 40A4 located on a portion of the first lateral surface WS1, and the fifth surface portion 40A5 located on a portion of the second lateral surface WS2, and the second external electrode 40B including the sixth surface portion 40B1 located on the second end surface LS2, at least one selected from the seventh surface portion 40B2 located on a portion of the first main surface TS1 and the eighth surface portion 40B3 located on a portion of the second main surface TS2, the ninth surface portion 40B4 located on a portion of the first lateral surface WS1, and the tenth surface portion 40B5 located on a portion of the second lateral surface WS2. In a case in which a dimension in the length direction between the first end surface LS1 and the second end surface LS2 of the multilayer body 10 is defined as l, a dimension in the width direction between the first lateral surface WS1 and the second lateral surface WS2 of the multilayer body 10 is defined as w, and a dimension in the height direction between the first main surface TS1 and the second main surface TS2 of the multilayer body 10 is defined as t, a dimensional relationship of w>l>t is satisfied. The dimension L4 in the length direction of the fourth surface portion 40A4 and the dimension L5 in the length direction of the fifth surface portion 40A5 of the first external electrode 40A are larger than the dimension L2 in the length direction L of the second surface portion 40A2 and the dimension L3 in the length direction of the third surface portion 40A3 of the first external electrode 40A, respectively. The dimension L9 in the length direction of the ninth surface portion 40B4 and the dimension L10 in the length direction of the tenth surface portion 40B5 of the second external electrode are larger than the dimension L7 in the length direction of the seventh surface portion 40B2 and the dimension L8 in the length direction L of the eighth surface portion 40B3 of the second external electrode 40B, respectively. With such a configuration, it is possible to increase the width of each of the extension portions at the end surface of the internal electrode layers 30. Further, since it is possible to reduce the distance between the first external electrode 40A and the second external electrode 40B, it is possible to reduce the ESL of the multilayer ceramic capacitor 1.

[0165] In addition, when the multilayer ceramic capacitor 1 is mounted on the substrate by soldering the first external electrode 40A and the second external electrode 40B, it is possible to sufficiently spread the solder on the fourth surface portion 40A4 and the fifth surface portion 40A5 of the first external electrode 40A and the ninth surface portion 40B4 and the tenth surface portion 40B5 of the second external electrode 40B, which tend to allow the solder to spread less. Therefore, in each of the fourth surface portion 40A4 and the fifth surface portion 40A5 of the first external electrode 40A and the ninth surface portion 40B4 and the tenth surface portion 40B5 of the second external electrode 40B, it is possible to reduce or prevent a change in the amount of solder and a difference in tensile stress caused by the solder. Therefore, it is possible to provide an LW reversed type multilayer ceramic capacitor that is able to reduce or prevent deterioration of a self-alignment effect and perform stable mounting.

[0166] (2) In the multilayer ceramic capacitor 1 according to the present example embodiment, the dimension L4 in the length direction of the fourth surface portion 40A4 and the dimension L5 in the length direction of the fifth surface portion 40A5 of the first external electrode 40A preferably are, for example, about 110% or more and about 245% or less of the dimension L2 in the length direction of the second surface portion 40A2 and the dimension L3 in the length direction of the third surface portion 40A3 of the first external electrode 40A, respectively, and the dimension L9 in the length direction of the ninth surface portion 40B4 and the dimension L10 in the length direction of the tenth surface portion 40B5 of the second external electrode 40B preferably are, for example, about 110% or more and about 245% or less of the dimension L7 in the length direction of the seventh surface portion 40B2 and the dimension L8 in the length direction of the eighth surface portion 40B3 of the second external electrode 40B, respectively. With such a configuration, it is possible to make the above-described advantageous effects more remarkable.

[0167] (3) In the multilayer ceramic capacitor 1 according to the present example embodiment, the internal electrode layers 30 each include the first internal electrode layer 31 and the second internal electrode layer 32. The first internal electrode layer 31 includes the first counter electrode portion 31A located in the multilayer body 10 and the first extension portion 31B that is connected to the first counter electrode portion 31A and is exposed at the first end surface LS1, a portion of the first lateral surface WS1, and a portion of the second lateral surface WS2, and the second internal electrode layer 32 includes the second counter electrode portion 32A located in the multilayer body 10 and the second extension portion 32B that is connected to the second counter electrode portion 32A and is exposed at the second end surface LS2, a portion of the first lateral surface WS1, and a portion of the second lateral surface WS2. Since it is possible to reduce the distance between the first extension portions 31B of the first internal electrode layers 31 and the second extension portions 32B of the second internal electrode layers 32, it is possible to reduce the electric current path. Therefore, it is possible to reduce ESL.

[0168] (4) In the multilayer ceramic capacitor 1 according to the present example embodiment, the first external electrode 40A includes the first base electrode layer 50A and the first plated layer 60A on the first base electrode layer 50A, the second external electrode 40B includes the second base electrode layer 50B and the second plated layer 60B on the second base electrode layer 50B, and the first base electrode layer 50A and the second base electrode layer 50B are each a sputtered electrode. With such a configuration, it is possible to provide thinner external electrodes. This provides a structure that further secures the thickness of the multilayer body 10, such that it is possible to secure the capacitance and the strength of the multilayer body 10.

[0169] (5) In the multilayer ceramic capacitor 1 according to the present example embodiment of the present invention, a length t in the height direction T between the first main surface TS1 and the second main surface TS2 of the multilayer body 10 is 150 μm or less. It is possible to appropriately achieve the advantageous effects of the present example embodiment of the present invention in such a multilayer ceramic capacitor with a reduced height.

[0170] (6) In the multilayer ceramic capacitor 1 according to the present example embodiment of the present invention, a length t in the height direction T between the first main surface TS1 and the second main surface TS2 of the multilayer body 10 preferably is about 100 μm or less, for example. It is possible to appropriately achieve the advantageous effects of the present example embodiment of the present invention in such a multilayer ceramic capacitor with a reduced height.

[0171] (7) In the multilayer ceramic capacitor 1 according to the present example embodiment of the present invention, a length t in the height direction T between the first main surface TS1 and the second main surface TS2 of the multilayer body 10 preferably is about 50 μm or less, for example. It is possible to appropriately achieve the advantageous effects of the present example embodiment of the present invention in such a multilayer ceramic capacitor with a reduced height.

[0172] Multilayer ceramic capacitors were produced as samples of the Example, and evaluation for mountability were performed.

[0173] First, as a sample of the Example 1, multilayer ceramic capacitors 1 having the following specifications shown in FIGS. 1 to 10B were manufactured according to the above-described manufacturing method. In addition, as a sample of Comparative Example 1, a multilayer ceramic capacitor 101 shown in FIG. 16A was manufactured in which the dimension in the length direction of the surface portions on the lateral surfaces of the external electrodes 140 (first external electrode 140A and second external electrode 140B) were equal or substantially equal to the dimension in the length direction of the surface portions on the main surface of the external electrodes 140. In addition, as a sample of Comparative Example 2, a multilayer ceramic capacitor 201 shown in FIG. 17A was manufactured in which the dimension in the length direction of the surface portions on the lateral surfaces of the external electrodes 240 (the first external electrode 240A and the second external electrode 240B) were equal or substantially equal to the dimension in the length direction of the surface portions on the main surface of the external electrodes 240 and in which a recess portion R recessed toward the end surface of the multilayer body 10 from the end edge of each of the external electrodes was provided.

[0174] FIG. 16A is an external perspective view of the multilayer ceramic capacitor 101 of Comparative Example 1, and corresponds to FIG. 1. FIG. 16B is a view of a first internal electrode layer 131 of the multilayer ceramic capacitor 101 of Comparative Example 1, and corresponds to FIG. 8A. FIG. 16C is a view of a second internal electrode layer 132 of the multilayer ceramic capacitor 101 of Comparative Example 1, and corresponds to FIG. 8B. FIG. 17A is an external perspective view of the multilayer ceramic capacitor 201 of Comparative Example 2, and corresponds to FIG. 1. FIG. 17B is a view of a first internal electrode layer 231 of the multilayer ceramic capacitor 201 of Comparative Example 2, and corresponds to FIG. 8A. FIG. 17C is a view of a second internal electrode layer 232 of the multilayer ceramic capacitor 201 of Comparative Example 2, and corresponds to FIG. 8B. In addition, the external electrode is omitted in FIG. 16B, FIG. 16C, FIG. 17B, and FIG. 17C.

• • [0175] Dimensions of multilayer ceramic capacitor: L×W×T=0.520 mm×1.000 mm×0.100 mm
  • [0176] Ceramic material of dielectric layer: BaTiO₃
  • [0177] Capacitance: 0.47 μF
  • [0178] Rated voltage: 4 V
  • [0179] Material of internal electrode layer: nickel
  • [0180] Pattern of internal electrode layer: pattern shown in FIG. 8A and FIG. 8B
    Structure of External Electrode:
  • [0181] Base electrode layer: thin film layer (sputtered electrode)
  • [0182] Material of base electrode layer: two-layer structure of NiCr layer and NiCu layer
  • [0183] Thickness of base electrode layer: main surface thickness of 0.2 μm (thickness of base electrode layer provided in each of first main surface TS1 and second main surface TS2)
  • [0184] Plated layer: three-layer structure of Cu plating, Ni plating, and Sn plating
  • [0185] Cu plating thickness: 5.5 μm
  • [0186] Ni plating thickness: 2.5 μm
  • [0187] Sn plating thickness: 3.2 μm
    • [0188] The dimension in the length direction of each surface portion (fourth surface portion and fifth surface portion) on a lateral surface of the first external electrode was 180% of the dimension in the length direction of each surface portion (second surface portion and third surface portion) on the main surface of the first external electrode.
    • [0189] The dimension in the length direction of each surface portion (the ninth surface portion and the tenth surface portion) on a lateral surface of the second external electrode was 180% of the dimension in the length direction of each surface portion (the seventh surface portion and the eighth surface portion) on the main surface of the second external electrode.

• • [0190] Dimensions of multilayer ceramic capacitor: L×W×T=0.520 mm×1.000 mm×0.100 mm
  • [0191] Ceramic material of dielectric layer: BaTiO₃
  • [0192] Capacitance: 0.47 μF
  • [0193] Rated voltage: 4 V
  • [0194] Material of internal electrode layer: Nickel
  • [0195] Pattern of internal electrode layer: pattern shown in FIG. 16B and FIG. 16C
    Structure of External Electrode:
  • [0196] Base electrode layer: fired layer obtained by applying electrically conductive paste thereto and firing
  • [0197] Material of base electrode layer: nickel
  • [0198] Thickness of base electrode layer: end surface thickness of 10 μm, lateral surface thickness of 5 μm, main surface thickness of 5 μm (thickness of base electrode layer provided in each of first main surface TS1 and second main surface TS2)
  • [0199] Plated layer: three-layer structure of Cu plating, Ni plating, and Sn plating
  • [0200] Cu plating thickness: 5.5 μm
  • [0201] Ni plating thickness: 2.5 μm
  • [0202] Sn plating thickness: 3.2 μm

• • [0203] Dimensions of multilayer ceramic capacitor: L×W×T=0.520 mm×1.000 mm×0.100 mm
  • [0204] Ceramic material of dielectric layer: BaTiO₃
  • [0205] Capacitance: 0.47 μF
  • [0206] Rated voltage: 4 V
  • [0207] Material of internal electrode layer: nickel
  • [0208] Pattern of internal electrode layer: pattern shown in FIG. 17B and FIG. 17C
    Structure of External Electrode:
  • [0209] Base electrode layer: thin film layer (sputtered electrode)
  • [0210] Material of base electrode layer: two layers of NiCr layer and NiCu layer
  • [0211] Thickness of base electrode layer: main surface thickness of 0.2 μm (thickness of base electrode layer provided in each of first main surface TS1 and second main surface TS2)
  • [0212] Plated layer: three-layer structure of Cu plating, Ni plating, and Sn plating
  • [0213] Cu plating thickness: 5.5 μm
  • [0214] Ni plating thickness: 2.5 μm
  • [0215] Sn plating thickness: 3.2 μm

[0216] Next, the prepared samples were used to evaluate mountability.

Mountability Evaluation 1

[0217] Mountability was evaluated using samples of Example 1 and samples of Comparative Example 1 and Comparative Example 2. Evaluation was performed using 100 samples each. Table 1 shows the results of the evaluation in relation to the mountability.

[0218]

	TABLE 1
	ROTATION	SHORT CIRCUIT
	Example	0/100	0/100
	Comparative Example 1	8/100	0/100
	Comparative Example 2	15/100	2/100

[0219] In Comparative Example 1, rotation failure occurred in eight samples. The evaluation was performed by increasing the amount of solder. Therefore, it is presumed that a difference occurred in solder wetting between the first external electrode and the second external electrode such that the rotational failure occurred.

[0220] In Comparative Example 2, rotation failure occurred in fifteen samples. Two among the fifteen samples had large rotational amounts, and were mounted so as to cause one external electrode to straddle on lands having differing polarities, such that short-circuit failure occurred. In the samples of Comparative Example 2, it is presumed that, due to the formation position, thickness variation, etc. of the base electrode layer and the plated layer provided on the base electrode layer, variations occur in the area and shape of the external electrode covering the ridges of the first lateral surface portion and the second lateral surface portion of the multilayer body, such that variations in solder wetting on the external electrodes of the first lateral surface portion and the second lateral surface portion are likely to occur and there may occur a large difference in the amount of solder wetting. Consequently, it is presumed that the rotational failure occurred due to the difference in the application of the tensile stresses of the solder to the multilayer ceramic capacitor.

[0221] The evaluation method in the Example is described below.

Evaluation Method for Mountability

[0222] FIGS. 18A to 18D are diagrams for explaining non-limiting examples of methods of evaluating the mountability. First, solder (solder composition Sn-3.0Ag-0.5Cu) was printed respectively on two lands 310A and 310B provided on a glass-epoxy substrate 300 shown in FIG. 18A. The amount of solder at this time was 1.5 times that of the normal test in order to make the conditions more severe than those at the time of the normal test. Specifically, solder having thickness of 150 μm was printed for each land. As shown in FIG. 18A, the dimension in the width direction of the land was 1.0 mm, the dimension in the length direction of the land was 0.3 mm, and the distance between the two lands was 0.2 mm.

[0223] The multilayer ceramic capacitor was then placed on the solder-coated lands. At this time, as shown in FIG. 18B, in the middle of the land in the length of width direction, a reference line was taken so as to be perpendicular or substantially perpendicular to the width direction of the land, and the multilayer ceramic capacitor was placed so that the middle in the width direction W of the multilayer ceramic capacitor was positioned at a position 0.1 mm away from the reference line in the width direction of the land. At this time, placing was done so that the angle θ formed by the multilayer ceramic capacitor with the land shown in FIG. 18C, that is, the angle θ formed by the acute angle between one of the opposing inner sides of the two lands and the surface on first end surface LS1 side or the second end surface LS2 side of the external electrode of the multilayer ceramic capacitor was 5° or less.

[0224] Thereafter, the external electrode of the multilayer ceramic capacitor was solder-bonded to the land by reflow soldering, and the multilayer ceramic capacitor was mounted on the board. After the mounting, the mounting condition of the multilayer ceramic capacitor was observed, and the angle θ formed by the land and the multilayer ceramic capacitor was inclined by 5° or more was evaluated as rotation failure. Furthermore, as shown in FIG. 18D, the multilayer ceramic capacitor greatly rotated and was mounted to cause the first external electrode or the second external electrode so as to straddle the two lands. This was evaluated as short-circuit failure.

Mountability Evaluation 2

[0225] In the multilayer ceramic capacitor of Example 1 of the above specification, 100 samples of Examples 2 to 5 in which the following ratio A and ratio B were changed were additionally prepared, and mountability was evaluated in the same manner as described above. Table 2 shows the ratio A and the ratio B of Examples 1 to 6, and also shows the evaluation results of the mountability.

[0226] “Ratio A”: ratio of the dimension in the length direction of each of the surface portions (the fourth surface portion and the fifth surface portion) on the lateral surface of the first external electrodes to the dimension in the length direction of each of the surface portions (the second surface portion and the third surface portion) on the main surface of the first external electrodes.

[0227] “Ratio B”: ratio of the dimension in the length direction of each of the surface portions (the ninth surface portion and the tenth surface portion) on the lateral surface of the second external electrodes to the dimension in the length direction of each of the surface portions (the seventh surface portion and the eighth surface portion) on the main surface of the second external electrode.

[0228]

	TABLE 2
	RATIO A	RATIO B	ROTATION	SHORT CIRCUIT
Example 2	105	105	1/100	0/100
Example 3	110	110	0/100	0/100
Example 1	180	180	0/100	0/100
Example 4	220	220	0/100	0/100
Example 5	245	245	0/100	0/100
Example 6	250	250	0/100	2/100

[0229] In Example 2 in which the ratio A and the ratio B were 105%, one sample in which rotation occurred was generated. This is probably because the difference in tensile stress caused by the solder was unlikely to be reduced or prevented, and rotation occurred. On the other hand, in Example 6 in which the ratio A and the ratio B are 250%, since the distance between the surface portion of the first external electrode on the lateral surface and the surface portion of the second external electrode became short, it is assumed that the solder adhered to both electrodes and conducted, and a short circuit occurred. In view of the above, the ratio A and the ratio B are preferably 110% or more and 245% or less.

[0230] In calculating the ratio A and the ratio B, the dimension in the length direction L of the second surface portion 40A2 and the third surface portion 40A3 of the first external electrode 40A and the seventh surface portion 40B2 and the eighth surface portion 40B3 of the second external electrode 40B, which are surface portions on the main surface, and the dimension in the length direction L of the fourth surface portion 40A4 and the fifth surface portion 40A5 of the first external electrode 40A and the ninth surface portion 40B4 and the tenth surface portion 40B5 of the second external electrode 40B, which are surface portions on a lateral surface, are measured by the following method.

Method for Measuring Surface Portion on Main Surface

[0231] The dimension in the length direction L of the second surface portion 40A2 and the seventh surface portion 40B2 is measured by a microscope at a position which is one half in the width direction W when observed from the first main surface TS1 of the multilayer body 10. Similarly, the dimension in the length direction L of the third surface portion 40A3 and the eighth surface portion 40B3 is measured by a microscope at a position which is one half in the width direction W when observed from the second main surface TS2 of the multilayer body 10.

Method for Measuring Surface Portion on Lateral Surface

[0232] The dimension in the length direction L of the fourth surface portion 40A4 and the ninth surface portion 40B4 are measured by a microscope at a position of one half in the height direction T when observed from the first lateral surface WS1 of the multilayer body 10. Similarly, the dimension in the length direction L of the fifth surface portion 40A5 and the tenth surface portion 40B5 is measured by a microscope at a position which is one half in the height direction T when observed from the second lateral surface WS2 of the multilayer body 10.

[0233] The present invention is not limited to the configurations of the above example embodiments, and can be appropriately modified and applied without deviating from the gist of the present invention. It is to be noted that the present invention also encompasses a combination of two or more of the individual desirable configurations described in the above example embodiments.

[0234] While example embodiments of the present invention have been described above, it is to be understood that variations and modifications will be apparent to those skilled in the art without departing from the scope and spirit of the present invention. The scope of the present invention, therefore, is to be determined solely by the following claims.